Date:2011-05-27 11:31:11 (8 years 3 months ago)
Author:Werner Almesberger
Commit:2f6c22dbba47a6f020e59958bc75c72215dc077d
Message:prod/doc/: converted index.html to index.hmac

Files: prod/doc/Makefile (1 diff)
prod/doc/index.hmac (1 diff)
prod/doc/index.html (1 diff)

Change Details

prod/doc/Makefile
99
1010.PHONY: all upload clean
1111
12all: $(PNGS) $(JPGS)
12all: $(HTMLS) $(PNGS) $(JPGS)
1313
14index.html: index.hmac style.inc hmac.pl
15        perl hmac.pl index.hmac >$@ || { rm -f $@; exit 1; }
16
1417flow.png: flow.fig
1518        fig2dev -L png -m 0.7 -S 4 $< $@ || { rm -f $@; exit 1; }
1619
prod/doc/index.hmac
1<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.01 Transitional//EN">
2<HTML>
3<TITLE>Production and testing</TITLE>
4<BODY bgcolor="#ffffff" link="#000000" vlink="#404040">
5
6<INCLUDE file="style.inc">
7
8<PAGE_BAR title="Production and testing">
9  <PAGE_ITEM href="setup.html">Software setup</PAGE_ITEM>
10  <PAGE_ITEM href="flash.html">Flashing</PAGE_ITEM>
11  <PAGE_ITEM href="test.html">Functional test</PAGE_ITEM>
12  <PAGE_ITEM href="analysis.html">Fault analysis</PAGE_ITEM>
13</PAGE_BAR>
14
15<SECTION_BAR>
16  <SECTION_ITEM href="#terminology">Terminology</SECTION_ITEM>
17  <SECTION_ITEM href="#details">Detailed description</SECTION_ITEM>
18</SECTION_BAR>
19<P>
20
21This document gives a high-level description of the production test process
22for <B>atben</B> and <B>atusb</B> boards, plus - in the case of <B>atusb</B>
23the production steps required between the boards leaving the SMT line and the
24actual testing.
25<P>
26The testing serves two purposes:
27<OL>
28  <LI>Ascertain the correctness of the preceding production steps, and
29  <LI>identify suffering from random production flaws and either discard
30    them or prepare them for repair.
31</OL>
32The results of testing and fault analysis also provide feedback for the
33SMT process and steps preceding it.
34<P>
35The following diagram illustrates the workflow:
36<P>
37<IMG src="flow.png">
38<P>
39Only <B>atusb</B> boards contain firmware and need flashing (which is
40a two-step process, see below). The functional tests and further fault
41analysis are largely the same for <B>atben</B> and <B>atusb</B>.
42<P>
43Devices accepted for further use can then be packaged for shipping.
44Defective devices can be discarded or retained for a deeper analysis.
45
46
47<!-- ====================================================================== -->
48
49
50<SECTION ref="terminology" title="Terminology">
51
52<DL>
53  <DT>Ben</DT>
54  <DD>a device capable of hosting the <B>atben</B> and <B>atusb-pgm</B>
55    boards. In the production process, a Ben can perform three different
56    roles:
57    <OL>
58      <LI> Host an <B>atben</B> board acting as DUT
59      <LI> Host an <B>atben</B> board acting as reference
60      <LI> Host an <B>atusb-pgm</B> used for flashing the boot loader
61    </OL>
62    In this document, we assume that a single Ben is used in all
63    three roles, with the board in its 8:10 card slot changed as
64    the role requires.
65  <DT>PC</DT>
66  <DD>a device capable of connecting to a Ben via USB, and of hosting an
67    <B>atusb</B> board. In the production process, a PC can perform three
68    different roles:
69    <OL>
70      <LI> Host an <B>atusb</B> board acting as DUT
71      <LI> Host an <B>atusb</B> board acting as reference
72      <LI> Control a Ben via USB (for convenience)
73    </OL>
74    In this document, we assume that a single PC is used in all
75    three roles, with one USB host port permanently connecting to the
76    Ben, and a second USB host port populated with <B>atusb</B> boards
77    as needed.
78  <DT>DUT</DT>
79  <DD>Device Under Test. An <B>atben</B> or <B>atusb</B> board that
80    has left SMT, and is being prepared for testing or is in the process
81    of being tested.
82  <DT>Reference device</DT>
83  <DD>An <B>atben</B> or <B>atusb</B> device that is known to work and
84    and that acts as a peer for RF communication with the DUT.
85  <DT>SMT</DT>
86  <DD>In this context, the actual process of soldering components to
87    the unpopulated PCB, and all related tasks providing an input to
88    this process. Such related tasks include the configuration of the
89    SMT line, and testing and conditioning of the components prior to
90    soldering.
91</DL>
92
93
94<!-- ====================================================================== -->
95
96
97<SECTION ref="details" title="Detailed description">
98
99The following pages describe the preparation and the execution of the
100production and test process:
101<UL>
102  <LI><A href="setup.html">Software setup</A>
103  <LI><A href="flash.html">Flashing (<B>atusb</B> only)</A>
104  <LI><A href="test.html">Functional test</A>
105  <LI><A href="analysis.html">Fault analysis</A>
106</UL>
107
108
109<P>
110<HR>
111Last update: 2011-05-27&nbsp;&nbsp;<I>Werner Almesberger</I>
112<HR>
113</BODY>
114</HTML>
prod/doc/index.html
1<TITLE>Production and testing</TITLE>
2<BODY>
3<HTML>
4<H1>Production and testing</H1>
5
6This document gives a high-level description of the production test process
7for <B>atben</B> and <B>atusb</B> boards, plus - in the case of <B>atusb</B>
8the production steps required between the boards leaving the SMT line and the
9actual testing.
10<P>
11The testing serves two purposes:
12<OL>
13  <LI>Ascertain the correctness of the preceding production steps, and
14  <LI>identify suffering from random production flaws and either discard
15    them or prepare them for repair.
16</OL>
17The results of testing and fault analysis also provide feedback for the
18SMT process and steps preceding it.
19<P>
20The following diagram illustrates the workflow:
21<P>
22<IMG src="flow.png">
23<P>
24Only <B>atusb</B> boards contain firmware and need flashing (which is
25a two-step process, see below). The functional tests and further fault
26analysis are largely the same for <B>atben</B> and <B>atusb</B>.
27<P>
28Devices accepted for further use can then be packaged for shipping.
29Defective devices can be discarded or retained for a deeper analysis.
30
31
32<!-- ====================================================================== -->
33
34
35<H2>Terminology</H2>
36
37<DL>
38  <DT>Ben</DT>
39  <DD>a device capable of hosting the <B>atben</B> and <B>atusb-pgm</B>
40    boards. In the production process, a Ben can perform three different
41    roles:
42    <OL>
43      <LI> Host an <B>atben</B> board acting as DUT
44      <LI> Host an <B>atben</B> board acting as reference
45      <LI> Host an <B>atusb-pgm</B> used for flashing the boot loader
46    </OL>
47    In this document, we assume that a single Ben is used in all
48    three roles, with the board in its 8:10 card slot changed as
49    the role requires.
50  <DT>PC</DT>
51  <DD>a device capable of connecting to a Ben via USB, and of hosting an
52    <B>atusb</B> board. In the production process, a PC can perform three
53    different roles:
54    <OL>
55      <LI> Host an <B>atusb</B> board acting as DUT
56      <LI> Host an <B>atusb</B> board acting as reference
57      <LI> Control a Ben via USB (for convenience)
58    </OL>
59    In this document, we assume that a single PC is used in all
60    three roles, with one USB host port permanently connecting to the
61    Ben, and a second USB host port populated with <B>atusb</B> boards
62    as needed.
63  <DT>DUT</DT>
64  <DD>Device Under Test. An <B>atben</B> or <B>atusb</B> board that
65    has left SMT, and is being prepared for testing or in the process
66    of being tested.
67  <DT>Reference device</DT>
68  <DD>An <B>atben</B> or <B>atusb</B> device that is known to work and
69    and that acts as a peer for RF communication with the DUT.
70  <DT>SMT</DT>
71  <DD>In this context, the actual process of soldering components to
72    the unpopulated PCB, and all related tasks providing an input to
73    this process. Such related tasks include the configuration of the
74    SMT line, and testing and conditioning of the components prior to
75    soldering.
76</DL>
77
78
79<!-- ====================================================================== -->
80
81
82<H2>Detailed description</H2>
83
84The following pages describe the preparation and the execution of the
85production and test process:
86<UL>
87  <LI><A href="setup.html">Software setup</A>
88  <LI><A href="flash.html">Flashing (<B>atusb</B> only)</A>
89  <LI><A href="test.html">Functional test</A>
90  <LI><A href="analysis.html">Fault analysis</A>
91</UL>
92
93
94<P>
95<HR>
96Last update: 2011-05-19&nbsp;&nbsp;<I>Werner Almesberger</I>
97<HR>
98</BODY>
99</HTML>

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