Production and testing
This document gives a high-level description of the production test process
for atben and atusb boards, plus - in the case of atusb
the production steps required between the boards leaving the SMT line and the
The testing serves two purposes:
The results of testing and fault analysis also provide feedback for the
SMT process and steps preceding it.
- Ascertain the correctness of the preceding production steps, and
- identify suffering from random production flaws and either discard
them or prepare them for repair.
The following diagram illustrates the workflow:
Only atusb boards contain firmware and need flashing (which is
a two-step process, see below). The functional tests and further fault
analysis are largely the same for atben and atusb.
Devices accepted for further use can then be packaged for shipping.
Defective devices can be discarded or retained for a deeper analysis.
- a device capable of hosting the atben and atusb-pgm
boards. In the production process, a Ben can perform three different
In this document, we assume that a single Ben is used in all
three roles, with the board in its 8:10 card slot changed as
the role requires.
- Host an atben board acting as DUT
- Host an atben board acting as reference
- Host an atusb-pgm used for flashing the boot loader
- a device capable of connecting to a Ben via USB, and of hosting an
atusb board. In the production process, a PC can perform three
In this document, we assume that a single PC is used in all
three roles, with one USB host port permanently connecting to the
Ben, and a second USB host port populated with atusb boards
- Host an atusb board acting as DUT
- Host an atusb board acting as reference
- Control a Ben via USB (for convenience)
- Device Under Test. An atben or atusb board that
has left SMT, and is being prepared for testing or in the process
of being tested.
- Reference device
- An atben or atusb device that is known to work and
and that acts as a peer for RF communication with the DUT.
- In this context, the actual process of soldering components to
the unpopulated PCB, and all related tasks providing an input to
this process. Such related tasks include the configuration of the
SMT line, and testing and conditioning of the components prior to
The following pages describe the preparation and the execution of the
production and test process:
Last update: 2011-05-19 Werner Almesberger