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Source at commit 850e9fca290d2354e97589ff1d5d684523218085 created 13 years 5 months ago.
By Werner Almesberger, More rm -rf to rm -f changes.
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# TI meandered inverted F antenna
9F: meander
10N: AN043
11
12# Mini-USB B receptable (SMT; almost generic)
13F: mini_usb_b
14
15# Standard rectangular passive components
16F: stdpass
17
18# "Generic" simple QFN
19F: qfn
20#
21# The information for these packages comes from various sources:
22#
23# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
24# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
25# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
26# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
27# http://www.nxp.com/package/SOT617-1.html
28# http://www.nxp.com/package/SOT617-3.html
29#
30# Known bugs:
31#
32# - we should distribute the solder paste in an array of small
33# squares instead of just covering the whole center pad.
34# - really ought to merge all the various QFN definitions (we have more
35# over at gta02-core) into a single QFN file with a big mean table of
36# everything
37#
38N: sot617-3-lp
39
40# "Generic" simple QFP (for now, just for Silabs' C8051F320)
41F: qfp
42
43# Common 4-pin crystal SMT package (pins 1 and 4 are on a short side, pin
44# numbering is counter-clockwise)
45F: xtal-4
46N: nx3225sa
47
48# Solder pads and test points
49F: pads
50
51# 0805 package with six pads
52F: 0805-6
53

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