IEEE 802.15.4 subsystem
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1 | <!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.01 Transitional//EN"> |
2 | <HTML> |
3 | <TITLE>Production and testing</TITLE> |
4 | <BODY bgcolor="#ffffff" link="#000000" vlink="#404040"> |
5 | |
6 | <INCLUDE file="style.inc"> |
7 | |
8 | <PAGE_BAR title="Production and testing"> |
9 | <PAGE_ITEM href="setup.html">Software setup</PAGE_ITEM> |
10 | <PAGE_ITEM href="flash.html">Flashing</PAGE_ITEM> |
11 | <PAGE_ITEM href="test.html">Functional test</PAGE_ITEM> |
12 | <PAGE_ITEM href="analysis.html">Fault analysis</PAGE_ITEM> |
13 | </PAGE_BAR> |
14 | |
15 | <SECTION_BAR> |
16 | <SECTION_ITEM href="#intro">Introduction</SECTION_ITEM> |
17 | <SECTION_ITEM href="#terminology">Terminology</SECTION_ITEM> |
18 | <SECTION_ITEM href="#details">Detailed description</SECTION_ITEM> |
19 | </SECTION_BAR> |
20 | |
21 | |
22 | <!-- ====================================================================== --> |
23 | |
24 | |
25 | <SECTION ref="intro" title="Introduction"> |
26 | |
27 | This document gives a high-level description of the production test process |
28 | for <B>atben</B> and <B>atusb</B> boards, plus - in the case of <B>atusb</B> |
29 | the production steps required between the boards leaving the SMT line and the |
30 | actual testing. |
31 | <P> |
32 | The testing serves two purposes: |
33 | <OL> |
34 | <LI>Ascertain the correctness of the preceding production steps, and |
35 | <LI>identify boards suffering from random production flaws and either |
36 | discard them or prepare them for repair. |
37 | </OL> |
38 | The results of testing and fault analysis also provide feedback for the |
39 | SMT process and steps preceding it. |
40 | <P> |
41 | The following diagram illustrates the workflow: |
42 | <P> |
43 | <IMG src="flow.png"> |
44 | <P> |
45 | Only <B>atusb</B> boards contain firmware and need flashing (which is |
46 | a two-step process, see below). The functional tests and fault |
47 | analysis are largely the same for <B>atben</B> and <B>atusb</B>. |
48 | <P> |
49 | Devices accepted for further use can then be packaged for shipping. |
50 | Defective devices can be discarded or retained for a deeper analysis. |
51 | |
52 | |
53 | <!-- ====================================================================== --> |
54 | |
55 | |
56 | <SECTION ref="terminology" title="Terminology"> |
57 | |
58 | <DL> |
59 | <DT><B><I>Ben</I></B></DT> |
60 | <DD>a device capable of hosting the <B>atben</B> and <B>atusb-pgm</B> |
61 | boards. In the production process, a Ben can perform three different |
62 | roles: |
63 | <OL> |
64 | <LI> Host an <B>atben</B> board acting as DUT |
65 | <LI> Host an <B>atben</B> board acting as reference |
66 | <LI> Host an <B>atusb-pgm</B> used for flashing the boot loader |
67 | </OL> |
68 | In this document, we assume that a single Ben is used in all |
69 | three roles, with the board in its 8:10 card slot changed as |
70 | the role requires. |
71 | <DT><B><I>PC</I></B></DT> |
72 | <DD>a device running Linux. Capable of connecting to a Ben via USB, and |
73 | of hosting an |
74 | <B>atusb</B> board. In the production process, a PC can perform three |
75 | different roles: |
76 | <OL> |
77 | <LI> Host an <B>atusb</B> board acting as DUT |
78 | <LI> Host an <B>atusb</B> board acting as reference |
79 | <LI> Control a Ben via USB (for convenience and to coordinate tests |
80 | involving a sender and a receiver) |
81 | </OL> |
82 | In this document, we assume that a single PC is used in all |
83 | three roles, with one USB host port permanently connecting to the |
84 | Ben, and a second USB host port populated with <B>atusb</B> boards |
85 | as needed. |
86 | <DT><B><I>DUT</I></B></DT> |
87 | <DD>Device Under Test. An <B>atben</B> or <B>atusb</B> board that |
88 | has left SMT, and is being prepared for testing or is in the process |
89 | of being tested. |
90 | <DT><B><I>Reference device</I></B></DT> |
91 | <DD>An <B>atben</B> or <B>atusb</B> device that is known to work and |
92 | and that acts as a peer for RF communication with the DUT. |
93 | <DT><B><I>SMT</I></B></DT> |
94 | <DD>In this context, the actual process of soldering components to |
95 | the unpopulated PCB, and all related tasks providing an input to |
96 | this process. Such related tasks include the configuration of the |
97 | SMT line, and testing and conditioning of the components prior to |
98 | soldering. |
99 | </DL> |
100 | |
101 | |
102 | <!-- ====================================================================== --> |
103 | |
104 | |
105 | <SECTION ref="details" title="Detailed description"> |
106 | |
107 | The following pages describe the preparation and the execution of the |
108 | production and test process: |
109 | <UL> |
110 | <LI><A href="setup.html">Software setup</A> |
111 | <LI><A href="flash.html">Flashing (<B>atusb</B> only)</A> |
112 | <LI><A href="test.html">Functional test</A> |
113 | <LI><A href="analysis.html">Fault analysis</A> |
114 | </UL> |
115 | |
116 | |
117 | <END author="Werner Almesberger" date="<GEN_DATE>"> |
118 | </BODY> |
119 | </HTML> |
120 |