IEEE 802.15.4 subsystem

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IEEE 802.15.4 subsystem Updates

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Mar 23, 2011
7 years 8 months makefiles/Makefile.kicad: fix dependency bugs
7 years 8 months include overview images in PCB and SMT fab packages
7 years 8 months added generation of SMT fab file package (in progress)
7 years 8 months Makefile.kicad: added generation of a positioning for the SMT fab
7 years 8 months makefiles/Makefile.kicad: changed eda-tools/gerber/ to eda-tools/fab/
Mar 22, 2011
7 years 8 months bom/Makefile: added generation of an SMT fab-type BOM
7 years 8 months atusb: updated QFN footprints and version
7 years 8 months atben: updated QFN footprint and version
7 years 8 months atben, atusb: added comments specifying the grid sizes
7 years 8 months increased solder paste deposits in QFN32-VHHD-2 and QFN32-VHHD-6
7 years 8 months Makefile.recurse: moved into makefiles/
7 years 8 months consolidated atben/Makefile and atusb/Makefile into common template
7 years 8 months atben, atusb: added Makefile targets to generate "pretty" overview images
7 years 8 months atben, atusb: updated back solder mask status (it's no longer empty)
7 years 8 months atusb.brd: more silk screen cleanup
7 years 8 months atben.brd: leave ground plane in 8:10 slot uncovered; more minor cleanup
7 years 8 months atben.brd: further silk screen beautification
7 years 8 months atusb.brd: some more component reference adjustments
7 years 8 months atben.brd (C1): moved component reference for more consistent appearance
7 years 8 months atben.brd: shifted C2 and C4 to increase solder mask clearance


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