IEEE 802.15.4 subsystem

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IEEE 802.15.4 subsystem Updates

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Mar 15, 2011
8 years 5 months atben.brd: enabled Drawings layer and moved measurements there
8 years 5 months atben/Makefile: replace defective mlztx process with more robust cptx
8 years 5 months atben/Makefile (spotless): new target to also remove KiCAD "junk" files
8 years 5 months atusb/Makefile (spotless): new target to also remove KiCAD "junk" files
8 years 5 months atben/Makefile: merge comment layer (component references) into silk screen
8 years 5 months atusb: moved measurements to Drawings and merged Comments into silk screen
Mar 22, 2011
8 years 5 months atben, atusb: always invoke KiCAD with absolute paths lest .pro be ignored
8 years 5 months atben, atusb: set solder mask clearance to 5 mil and adjusted silk screen
8 years 5 months atben.brd: shifted C2 and C4 to increase solder mask clearance
8 years 5 months atben.brd (C1): moved component reference for more consistent appearance
8 years 5 months atusb.brd: some more component reference adjustments
8 years 5 months atben.brd: further silk screen beautification
8 years 5 months atben.brd: leave ground plane in 8:10 slot uncovered; more minor cleanup
8 years 5 months atusb.brd: more silk screen cleanup
8 years 5 months atben, atusb: updated back solder mask status (it's no longer empty)
8 years 5 months atben, atusb: added Makefile targets to generate "pretty" overview images
8 years 5 months consolidated atben/Makefile and atusb/Makefile into common template
8 years 5 months Makefile.recurse: moved into makefiles/
8 years 5 months increased solder paste deposits in QFN32-VHHD-2 and QFN32-VHHD-6
8 years 5 months atben, atusb: added comments specifying the grid sizes


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