Date:2012-06-15 05:13:44 (7 years 3 months ago)
Author:Adam Wang
Commit:3a6c44160dcc5c9238806e844ce36151c67f2cd7
Message:mic-ra-dip.fpd: added package of MIC-RA-DIP-${Dia}x${Height}

Files: modules/INFO (1 diff)
modules/mic-ra-dip.fpd (1 diff)

Change Details

modules/INFO
155155# http://focus.ti.com/lit/an/swra117d/swra117d.pdf
156156F: meander-2.4GHz
157157
158# Microphone, through hole type, bent pins
159F: mic-ra-dip
160#
161# - MIC-RA-DIP-${Dia}x${Height}: for example PRO SIGNAL the MP33125 data sheet, package drawing
162# http://www.farnell.com/datasheets/359234.pdf
163# be noted that placements of two pins based on bending pins to suitable right angle purpose.
164# the py# is the option to change to distance that you want.
165#
166
158167# Mini-USB B receptable (SMT; almost generic)
159168F: mini_usb_b
160169
modules/mic-ra-dip.fpd
1/* MACHINE-GENERATED ! */
2
3frame outline {
4    __0: vec @(-Dia/2, Height/2)
5    __2: vec .(Dia, py+factor*hole/2+2*w)
6    rect . __0 w
7    __1: vec @(Dia/2, -Height/2)
8    rect __0 . w
9}
10
11frame pins {
12    table
13        { n, dx }
14        { 1, -1 }
15        { 2, 1 }
16
17    __0: vec @(0mm, Height/2+py)
18    __1: vec .(dx*Pitch/2, 0mm)
19    __2: vec .(hole/2, hole/2)
20    __3: vec __1(-hole/2, -hole/2)
21    hole . __2
22    __4: vec __1(factor*hole/2, -factor*hole/2)
23    __5: vec __1(-factor*hole/2, factor*hole/2)
24    rpad "$n" . __4
25}
26
27package "MIC-RA-DIP-${Dia}x${Height}"
28unit auto
29
30table
31    { Dia, Height, Pitch, py }
32    { 9.7mm, 6.7mm, 2.54mm, 1.5mm }
33
34set w = 5mil
35
36set hole = 0.9mm
37
38set factor = 1.7
39
40frame outline @
41frame pins @
42measy outline.__1 >> outline.__0 -1mm
43measx outline.__0 >> outline.__1 -(Height+1mm)
44meas pins.__1 >> pins.__1 2mm
45measx pins.__3 -> pins.__2 -factor*hole/2

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