Date:2012-07-19 05:04:29 (6 years 9 months ago)
Author:Werner Almesberger
Commit:c0e33e587211ab4e9fa5b6cf4bb4b9fc5ec79113
Message:modules/usb_a_plug_smt.fpd: mixed TH/SMT; change the two TH pads to "bare"

Rationale: if soldering in the SMT process, one probably wants to check
the TH pads anyway, so there is little point in putting solder paste on
them with the hope that some may stick.

If soldering in a separate TH process, solder paste could clog the holes.
Files: modules/usb_a_plug_smt.fpd (1 diff)

Change Details

modules/usb_a_plug_smt.fpd
4444    __0: vec @(x, 0mm)
4545    __1: vec .(wo/2, ho/2)
4646    __2: vec __0(-wo/2, -ho/2)
47    rpad "$name" . __1
47    rpad "$name" . __1 bare
4848    __3: vec __0(wi/2, hi/2)
4949    __4: vec __0(-wi/2, -hi/2)
5050    hole . __3

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