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Source at commit 178fbc3effff8d508388a850486490632fe303c6 created 9 years 4 months ago.
By Adam Wang, rj45.fpd: RJ45-8-LED added 8 pins ethernet connectors with two leds version from Molex.
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# Printed 8:10 card contacs
9F: 8_10-card
10
11# Open clip for AA batteries, through-hole
12# http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf
13# Note: should generalize this for AAA and maybe also larger sizes
14F: bat-clip-aa-th
15
16# BGA
17F: bga
18# - 484-Pin FineLine BGA(FBGA), from Altera
19# http://www.altera.com/devicepackaging/04R00416-02.pdf
20#
21# - FG(G)484 Fine-Pitch BGA, from Xilinx
22# http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
23#
24
25# Chip SMD Aluminum Electrolytic Capacitors
26F: c-smd
27#
28# for example 10TZV220M6.3X8 from RUBYCON
29#
30# - c-smd-5mmx6.1mm, c-smd-6.3mmx8mm, c-smd-8mmx10.5mm, c-smd-10mmx10.5mm
31#
32# package drawing
33# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/e_TZV.pdf
34#
35# land pattern
36# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/Chip_Alumi_Eng.pdf
37#
38
39# Chip SMD Tantalum Capacitors
40F: c-t-smd
41#
42# for example T520B157M006ATE070 from KEMET
43#
44# - TC-$Case-$EIA-$Density
45# the density is based on the conditions outlined in IPC standard 7351 (IPC-7351).
46#
47# package drawing ( page 62 ), land pattern ( page 73 )
48# http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfiles/KEM_TC102_LOWESR.pdf/$file/KEM_TC102_LOWESR.pdf
49#
50
51# DO-214
52F: do-214
53#
54# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
55# http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
56#
57# - DO-214AB(SMC), from Fairchild
58# http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
59#
60# - DO-214AC(SMA), from Fairchild
61# http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
62#
63
64# EUS (R-PDSS-T6)
65F: eus
66#
67# - for example: the PTH04000WAH data sheet, it's EUS
68# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
69#
70
71# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
72F: fiducial
73
74# IR Receiver Module
75F: ir
76#
77# From Vishay:
78#
79# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
80# http://www.vishay.com/docs/81732/tsop348.pdf
81
82# LED right angle package
83F: ledsmd
84#
85# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
86# http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
87# added a letter 'R' stands for right angle land pattern
88# could expand it as else land pattern for 0603, 0805, 0805R, etc.
89#
90
91# MDIP
92F: mdip
93#
94# From FAIRCHILD:
95#
96# - the 6N138S data sheet
97# http://www.fairchildsemi.com/ds/6N/6N138.pdf
98#
99# Package Type:
100#
101# - MDIP 8L
102# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
103#
104# Package Drawing:
105#
106# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
107
108# Mini-USB B receptable (SMT; almost generic)
109F: mini_usb_b
110
111# Solder pads and test points
112F: pads
113
114# "pads" in typical array formations
115F: pads-array
116
117# "Generic" simple QFN
118F: qfn
119#
120# The information for these packages comes from various sources:
121#
122# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
123# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
124# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
125# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
126# http://www.nxp.com/package/SOT617-1.html
127# http://www.nxp.com/package/SOT617-3.html
128#
129# Solder paste:
130#
131# Footprint Center pad Closest NXP (with complete land pattern)
132# QFN28-Atmel 2.4 mm for further study
133# QFN28-SiLabs 3.3 mm use SiLab's specification
134# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
135# QFN32-VHHD-6 3.4 mm SOT818-1
136#
137# From NXP:
138#
139# Package Pad Paste zone Islands Isl. size Isl. gap
140# SiLabs 3.25 3.1 3 x 3 0.9
141# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
142# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
143#
144# NXP rules (AN10365):
145# - paste zone = 35% of pad area
146# - paste coverge = 20% of pad area
147#
148# Our parameters:
149#
150# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
151# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
152# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
153#
154# Known bugs:
155#
156# - really ought to merge all the various QFN definitions (we have more
157# over at gta02-core) into a single QFN file with a big mean table of
158# everything
159#
160N: sot617-3-lp
161
162# "Generic" simple QFP (for now, just for Silabs' C8051F320)
163F: qfp
164#
165# - the C8051F320 data sheet
166# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
167#
168# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
169# the LQPF48/TQFP48 referred to the same package drawing and land pattern
170#
171# - LQFP48, TQFP48: C48 -> package drawing
172# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
173#
174# - LQFP48, TQFP48: C48 -> package land pattern
175# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
176#
177# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
178# http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf
179#
180# - LQFP64, C64 -> package drawing
181# http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
182#
183# - LQFP64, C64 -> package land pattern
184# http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
185#
186
187# 3.5mm audio stereo phone jack
188F: phonejack
189#
190# phonejack-${size}-${N}
191# From SCPRE:
192#
193# - phonejack-3.5-5, the SCJ368R1NUS0B00G data sheet, drawing
194# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Audio/SCJ368R1NUS0B00G.pdf
195#
196
197# RJ45, 8 pins, two leds
198F: rj45
199#
200# - RJ45-8-LED, the 48025-0002 data sheet, drawing, from MOLEX
201# http://www.molex.com/pdm_docs/sd/480250002_sd.pdf
202#
203
204# SOIC
205F: soic
206#
207# From TI:
208#
209# - the SN75HVD12DR data sheet
210# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
211#
212# Package Drawing:
213#
214# - D(JEDEC)
215# - R-PDSO-G8
216# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
217# - R-PDSO-G14
218# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
219# - R-PDSO-G16
220# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
221
222# SOT generic package
223F: sot
224# experimental generic SOT footprint; currently only for
225#
226# - SOT-323 aka SC-70
227# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
228# - SOT-363 aka SC-88 aka SC-70-6
229# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
230# - SOT-523
231# http://www.diodes.com/datasheets/ds31784.pdf
232# - SOT-563
233# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
234#
235# some conflicts with the outline exist
236
237# SOT23 generic package with counter-clockweise or clockwise pin assignment
238F: sot23
239#
240# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
241# http://www.diodes.com/datasheets/APX803.pdf
242#
243# for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
244# http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
245#
246
247# Standard rectangular passive components
248F: stdpass
249#
250# packages: 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512
251# polarized(marked the cathode) packages: starts from 0603P to 2512P
252#
253# be noticed that 1812 land pattern based on a p/n: miniSMDC200F from Tycoelectronics
254# http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Catalog+Section%7FSURFACE-MOUNT%7FA1%7Fpdf%7FEnglish%7FENG_CS_SURFACE-MOUNT_A1.pdf%7FRF1410-000
255#
256
257# SOT-323 package with counter-clockweise or clockwise pin assignment
258F: sot-323
259N: mmst3904
260
261# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
262# http://www.nxp.com/packages/SOT341-1.html
263# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
264
265# "Generic" simple SSOP
266F: ssop
267#
268# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
269# http://www.micrel.com/_PDF/mic2550a.pdf
270#
271# - TSSOP14: from NXP -> package land pattern
272# http://www.nxp.com/packages/SOT402-1.html
273# http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf
274
275# "Generic" simple TO-252, TO-263
276F: to
277#
278# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
279# http://www.ti.com/lit/ds/symlink/lp38690.pdf
280#
281# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
282# http://www.national.com/packaging/mkt/td03b.pdf
283#
284# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
285# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
286#
287# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
288# http://www.national.com/packaging/mkt/tj5a.pdf
289#
290
291# "Generic" simple TSOP
292F: tsop
293#
294# - TSOP28: Z28 -> package drawing
295# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
296#
297# - TSOP28: Z28 -> package land pattern
298# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
299#
300# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
301# the TSOP32 referred to the same package drawing and land pattern
302#
303# - TSOP32: Z32 -> package drawing
304# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
305#
306# - TSOP32: Z32 -> package land pattern
307# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
308#
309# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
310# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
311#
312# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
313# http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf
314#
315# - TSOP66: currently referred to M1rc3 design files land pattern:
316# width of pad -> 0.4 mm, it's rectangle not round one
317# length of pad -> 1.25 mm
318# Width of body -> 400 mil
319
320# TSSOP5 for NXP
321F: tssop5
322#
323# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet,
324# http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
325# http://www.nxp.com/packages/SOT353-1.html
326# but without real land pattern found, still could refer link below for more in details:
327# http://www.nxp.com/documents/application_note/AN10365.pdf
328#
329# also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
330# they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
331#
332# NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
333# could use a land pattern of pad length to be 0.7 mm.
334#
335
336# USB A plug for SMT
337#
338# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
339# 0.1 mm with respect to the reference.
340#
341# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
342# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
343# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
344# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
345# 3.5 mm.
346#
347# Assuming that the pad is intended to extend a bit beyond the lead, we need
348# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
349# be intended to be used this way, however, we still have to consider small
350# errors in registration, which also amount to about 0.1 mm, so the calculation
351# remains valid.)
352#
353F: usb_a_plug_smt
354
355# USB 2.0 from usb_20_040908, page 99
356F: usb-a-pcb
357
358# 2-pins rectangular smd xtal
359F: xtal-2
360#
361# - xtal2-11.5mmx4.83mm package drawing, land pattern
362# for example R49SSA-028636-F20-YYY-YQA
363# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf
364#
365
366# 4-pins rectangular smd xtal
367F: xtal-4
368#
369# - xtal4-3.2mmx2.5mm package drawing, land pattern
370# for example NX3225SA
371# http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf
372#
373# - xtal4-5mmx3.2mm package drawing, land pattern
374# for example SO5032-050000-O3A-BBE-QA
375# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/FPGA/Qi%20Hardware%20SO5032-050000-O3A-BBE-QA.pdf
376#
377# - xtal4-6mmx3.6mm package drawing, land pattern
378# for example ABMM2-24.576MHZ-E2-T
379# http://www.abracon.com/Resonators/ABMM2.pdf
380#
381
382

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