KiCad Libraries
Sign in or create your account | Project List | Help
KiCad Libraries Git Source Tree
Root/
Source at commit 20c94362beec5278c00ccc1b0f54c8e53178f012 created 11 years 9 months ago. By Werner Almesberger, modules/pads-array.fpd: we need loop for pins and for packages, not just one | |
---|---|
1 | # |
2 | # Tags: |
3 | # |
4 | # F Footprint name (must be first) |
5 | # N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F) |
6 | # |
7 | |
8 | # Printed 8:10 card contacs |
9 | F: 8_10-card |
10 | |
11 | # Open clip for AA batteries, through-hole |
12 | # http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf |
13 | # Note: should generalize this for AAA and maybe also larger sizes |
14 | F: bat-clip-aa-th |
15 | |
16 | # BGA |
17 | F: bga |
18 | # - 484-Pin FineLine BGA(FBGA), from Altera |
19 | # http://www.altera.com/devicepackaging/04R00416-02.pdf |
20 | # |
21 | # - FG(G)484 Fine-Pitch BGA, from Xilinx |
22 | # http://www.xilinx.com/support/documentation/user_guides/ug385.pdf |
23 | # |
24 | |
25 | # Chip SMD Aluminum Electrolytic Capacitors |
26 | F: c-smd |
27 | # |
28 | # for example 10TZV220M6.3X8 from RUBYCON |
29 | # |
30 | # - c-smd-5mmx6.1mm, c-smd-6.3mmx8mm, c-smd-8mmx10.5mm, c-smd-10mmx10.5mm |
31 | # |
32 | # package drawing |
33 | # http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/e_TZV.pdf |
34 | # |
35 | # land pattern |
36 | # http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/Chip_Alumi_Eng.pdf |
37 | # |
38 | |
39 | # Chip SMD Tantalum Capacitors |
40 | F: c-t-smd |
41 | # |
42 | # for example T520B157M006ATE070 from KEMET |
43 | # |
44 | # - TC-$Case-$EIA-$Density |
45 | # the density is based on the conditions outlined in IPC standard 7351 (IPC-7351). |
46 | # |
47 | # package drawing ( page 62 ), land pattern ( page 73 ) |
48 | # http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfiles/KEM_TC102_LOWESR.pdf/$file/KEM_TC102_LOWESR.pdf |
49 | # |
50 | |
51 | # DO-214 |
52 | F: do-214 |
53 | # |
54 | # - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it |
55 | # http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf |
56 | # |
57 | # - DO-214AB(SMC), from Fairchild |
58 | # http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf |
59 | # |
60 | # - DO-214AC(SMA), from Fairchild |
61 | # http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf |
62 | # |
63 | |
64 | # EUS (R-PDSS-T6) |
65 | F: eus |
66 | # |
67 | # - for example: the PTH04000WAH data sheet, it's EUS |
68 | # http://www.ti.com/lit/ds/symlink/pth04000w.pdf |
69 | # |
70 | |
71 | # Fiducial (1 mm copper pad, 2 mm solder mask clearance) |
72 | F: fiducial |
73 | |
74 | # IR Receiver Module |
75 | F: ir |
76 | # |
77 | # From Vishay: |
78 | # |
79 | # - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet |
80 | # http://www.vishay.com/docs/81732/tsop348.pdf |
81 | |
82 | # LED right angle package |
83 | F: ledsmd |
84 | # |
85 | # - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing |
86 | # http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf |
87 | # added a letter 'R' stands for right angle land pattern |
88 | # could expand it as else land pattern for 0603, 0805, 0805R, etc. |
89 | # |
90 | |
91 | # MDIP |
92 | F: mdip |
93 | # |
94 | # From FAIRCHILD: |
95 | # |
96 | # - the 6N138S data sheet |
97 | # http://www.fairchildsemi.com/ds/6N/6N138.pdf |
98 | # |
99 | # Package Type: |
100 | # |
101 | # - MDIP 8L |
102 | # http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08 |
103 | # |
104 | # Package Drawing: |
105 | # |
106 | # http://www.fairchildsemi.com/dwg/N0/N08H.pdf |
107 | |
108 | # Mini-USB B receptable (SMT; almost generic) |
109 | F: mini_usb_b |
110 | |
111 | # Solder pads and test points |
112 | F: pads |
113 | |
114 | # "pads" in typical array formations |
115 | F: pads-array |
116 | |
117 | # "Generic" simple QFN |
118 | F: qfn |
119 | # |
120 | # The information for these packages comes from various sources: |
121 | # |
122 | # - the C8051F326 data sheet, for the QFN28 footprint (N: mcu) |
123 | # - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx) |
124 | # - Atmel's general recommendations for QFN land patterns (N: atmel-qfn) |
125 | # - NXP's SOT617-1 and SOT617-3, for package and land pattern: |
126 | # http://www.nxp.com/package/SOT617-1.html |
127 | # http://www.nxp.com/package/SOT617-3.html |
128 | # |
129 | # Solder paste: |
130 | # |
131 | # Footprint Center pad Closest NXP (with complete land pattern) |
132 | # QFN28-Atmel 2.4 mm for further study |
133 | # QFN28-SiLabs 3.3 mm use SiLab's specification |
134 | # QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1 |
135 | # QFN32-VHHD-6 3.4 mm SOT818-1 |
136 | # |
137 | # From NXP: |
138 | # |
139 | # Package Pad Paste zone Islands Isl. size Isl. gap |
140 | # SiLabs 3.25 3.1 3 x 3 0.9 |
141 | # SOT818-1 3.4 1.75 2 x 2 0.75 0.25 |
142 | # SOT788-1 4.0 2.4 3 x 3 0.6 0.3 |
143 | # |
144 | # NXP rules (AN10365): |
145 | # - paste zone = 35% of pad area |
146 | # - paste coverge = 20% of pad area |
147 | # |
148 | # Our parameters: |
149 | # |
150 | # Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage |
151 | # QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20% |
152 | # QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19% |
153 | # |
154 | # Known bugs: |
155 | # |
156 | # - really ought to merge all the various QFN definitions (we have more |
157 | # over at gta02-core) into a single QFN file with a big mean table of |
158 | # everything |
159 | # |
160 | N: sot617-3-lp |
161 | |
162 | # "Generic" simple QFP (for now, just for Silabs' C8051F320) |
163 | F: qfp |
164 | # |
165 | # - the C8051F320 data sheet |
166 | # http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf |
167 | # |
168 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
169 | # the LQPF48/TQFP48 referred to the same package drawing and land pattern |
170 | # |
171 | # - LQFP48, TQFP48: C48 -> package drawing |
172 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF |
173 | # |
174 | # - LQFP48, TQFP48: C48 -> package land pattern |
175 | # http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF |
176 | # |
177 | # - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing |
178 | # http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf |
179 | # |
180 | # - LQFP64, C64 -> package drawing |
181 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF |
182 | # |
183 | # - LQFP64, C64 -> package land pattern |
184 | # http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF |
185 | # |
186 | |
187 | # SOIC |
188 | F: soic |
189 | # |
190 | # From TI: |
191 | # |
192 | # - the SN75HVD12DR data sheet |
193 | # http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf |
194 | # |
195 | # Package Drawing: |
196 | # |
197 | # - D(JEDEC) |
198 | # - R-PDSO-G8 |
199 | # http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf |
200 | # - R-PDSO-G14 |
201 | # http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf |
202 | # - R-PDSO-G16 |
203 | # http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf |
204 | |
205 | # SOT generic package |
206 | F: sot |
207 | # experimental generic SOT footprint; currently only for |
208 | # |
209 | # - SOT-323 aka SC-70 |
210 | # http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF |
211 | # - SOT-363 aka SC-88 aka SC-70-6 |
212 | # http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF |
213 | # - SOT-523 |
214 | # http://www.diodes.com/datasheets/ds31784.pdf |
215 | # - SOT-563 |
216 | # http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF |
217 | # |
218 | # some conflicts with the outline exist |
219 | |
220 | # SOT23 generic package with counter-clockweise or clockwise pin assignment |
221 | F: sot23 |
222 | # |
223 | # - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern |
224 | # http://www.diodes.com/datasheets/APX803.pdf |
225 | # |
226 | # for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern |
227 | # http://www.fairchildsemi.com/dwg/MA/MA03D.pdf |
228 | # |
229 | |
230 | # Standard rectangular passive components |
231 | F: stdpass |
232 | # |
233 | # packages: 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 |
234 | # polarized(marked the cathode) packages: starts from 0603P to 2512P |
235 | # |
236 | # be noticed that 1812 land pattern based on a p/n: miniSMDC200F from Tycoelectronics |
237 | # http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Catalog+Section%7FSURFACE-MOUNT%7FA1%7Fpdf%7FEnglish%7FENG_CS_SURFACE-MOUNT_A1.pdf%7FRF1410-000 |
238 | # |
239 | |
240 | # SOT-323 package with counter-clockweise or clockwise pin assignment |
241 | F: sot-323 |
242 | N: mmst3904 |
243 | |
244 | # http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml] |
245 | # http://www.nxp.com/packages/SOT341-1.html |
246 | # http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf |
247 | |
248 | # "Generic" simple SSOP |
249 | F: ssop |
250 | # |
251 | # - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing |
252 | # http://www.micrel.com/_PDF/mic2550a.pdf |
253 | # |
254 | # - TSSOP14: from NXP -> package land pattern |
255 | # http://www.nxp.com/packages/SOT402-1.html |
256 | # http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf |
257 | |
258 | # "Generic" simple TO-252, TO-263 |
259 | F: to |
260 | # |
261 | # - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252 |
262 | # http://www.ti.com/lit/ds/symlink/lp38690.pdf |
263 | # |
264 | # - JEDEC Spec: TO-252 AA -> package drawing and land pattern |
265 | # http://www.national.com/packaging/mkt/td03b.pdf |
266 | # |
267 | # - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263 |
268 | # http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf |
269 | # |
270 | # - JEDEC Spec: TO-263 THIN -> package drawing and land pattern |
271 | # http://www.national.com/packaging/mkt/tj5a.pdf |
272 | # |
273 | |
274 | # "Generic" simple TSOP |
275 | F: tsop |
276 | # |
277 | # - TSOP28: Z28 -> package drawing |
278 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF |
279 | # |
280 | # - TSOP28: Z28 -> package land pattern |
281 | # http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF |
282 | # |
283 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
284 | # the TSOP32 referred to the same package drawing and land pattern |
285 | # |
286 | # - TSOP32: Z32 -> package drawing |
287 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF |
288 | # |
289 | # - TSOP32: Z32 -> package land pattern |
290 | # http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF |
291 | # |
292 | # - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56 |
293 | # http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx |
294 | # |
295 | # - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing |
296 | # http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf |
297 | # |
298 | # - TSOP66: currently referred to M1rc3 design files land pattern: |
299 | # width of pad -> 0.4 mm, it's rectangle not round one |
300 | # length of pad -> 1.25 mm |
301 | # Width of body -> 400 mil |
302 | |
303 | # TSSOP5 for NXP |
304 | F: tssop5 |
305 | # |
306 | # - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet, |
307 | # http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf |
308 | # http://www.nxp.com/packages/SOT353-1.html |
309 | # but without real land pattern found, still could refer link below for more in details: |
310 | # http://www.nxp.com/documents/application_note/AN10365.pdf |
311 | # |
312 | # also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353 |
313 | # they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it. |
314 | # |
315 | # NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm. |
316 | # could use a land pattern of pad length to be 0.7 mm. |
317 | # |
318 | |
319 | # USB A plug for SMT |
320 | # |
321 | # Note: the signal pads are enlarged by 0.2 mm and their center is shifted by |
322 | # 0.1 mm with respect to the reference. |
323 | # |
324 | # According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+ |
325 | # 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the |
326 | # edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the |
327 | # maximum lead end could be at 3.58 mm while the minimum pad edge could be at |
328 | # 3.5 mm. |
329 | # |
330 | # Assuming that the pad is intended to extend a bit beyond the lead, we need |
331 | # to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not |
332 | # be intended to be used this way, however, we still have to consider small |
333 | # errors in registration, which also amount to about 0.1 mm, so the calculation |
334 | # remains valid.) |
335 | # |
336 | F: usb_a_plug_smt |
337 | |
338 | # USB 2.0 from usb_20_040908, page 99 |
339 | F: usb-a-pcb |
340 | |
341 | # 2-pins rectangular smd xtal |
342 | F: xtal-2 |
343 | # |
344 | # - xtal2-11.5mmx4.83mm package drawing, land pattern |
345 | # for example R49SSA-028636-F20-YYY-YQA |
346 | # http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf |
347 | # |
348 | |
349 | # 4-pins rectangular smd xtal |
350 | F: xtal-4 |
351 | # |
352 | # - xtal4-3.2mmx2.5mm package drawing, land pattern |
353 | # for example NX3225SA |
354 | # http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf |
355 | # |
356 | # - xtal4-5mmx3.2mm package drawing, land pattern |
357 | # for example SO5032-050000-O3A-BBE-QA |
358 | # http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/FPGA/Qi%20Hardware%20SO5032-050000-O3A-BBE-QA.pdf |
359 | # |
360 | # - xtal4-6mmx3.6mm package drawing, land pattern |
361 | # for example ABMM2-24.576MHZ-E2-T |
362 | # http://www.abracon.com/Resonators/ABMM2.pdf |
363 | # |
364 | |
365 |
Branches:
master