Root/modules/INFO

Source at commit 26307b35a0aaa016894048889ce0c2a0e296122f created 6 years 11 months ago.
By Werner Almesberger, modules/INFO: add resources for ZX62-B-5PA and ZX62M-B-5P
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# Printed 8:10 card contacs
9F: 8_10-card
10
11# Open clip for AA batteries, through-hole
12# http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf
13# Note: should generalize this for AAA and maybe also larger sizes
14F: bat-clip-aa-th
15
16# 8:10 Card Socket Connectors RIGHT ANGLE SMT Hinge Type
17F: 8_10-socket-ra
18#
19# - 8:10-SOCKET-RA, package drawing, land pattern
20# for example MOLEX 500901-0801
21# http://www.molex.com/pdm_docs/sd/5009010801_sd.pdf
22#
23
24# BGA
25F: bga
26# - 484-Pin FineLine BGA(FBGA), from Altera
27# http://www.altera.com/devicepackaging/04R00416-02.pdf
28#
29# - FG(G)484 Fine-Pitch BGA, from Xilinx
30# http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
31#
32
33# Chip SMD Aluminum Electrolytic Capacitors
34F: c-smd
35#
36# for example 10TZV220M6.3X8 from RUBYCON
37#
38# - c-smd-5mmx6.1mm, c-smd-6.3mmx8mm, c-smd-8mmx10.5mm, c-smd-10mmx10.5mm
39#
40# package drawing
41# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/e_TZV.pdf
42#
43# land pattern
44# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/Chip_Alumi_Eng.pdf
45#
46
47# Chip SMD Tantalum Capacitors
48F: c-t-smd
49#
50# for example T520B157M006ATE070 from KEMET
51#
52# - TC-$Case-$EIA-$Density
53# the density is based on the conditions outlined in IPC standard 7351 (IPC-7351).
54#
55# package drawing ( page 62 ), land pattern ( page 73 )
56# http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfiles/KEM_TC102_LOWESR.pdf/$file/KEM_TC102_LOWESR.pdf
57#
58
59# SOCKET, PCB, DC POWER JACK
60F: dcjack
61#
62# - DCJACK-${L}x${W}, package drawing, land pattern
63# for example SCPRE SCD441CPS011B00G
64# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Supply/SCD441CPS011B00G.pdf
65#
66
67# SOCKET, DIN, PCB, 180, 5PIN, 5WAYS, 45 DEGREE
68F: din-5
69#
70# - DIN-SOCKET-PCB-5-45, package drawing, land pattern
71# for example DELTRON 671-0500
72# http://www.farnell.com/datasheets/65433.pdf
73#
74
75# DO-214
76F: do-214
77#
78# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
79# http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
80#
81# - DO-214AB(SMC), from Fairchild
82# http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
83#
84# - DO-214AC(SMA), from Fairchild
85# http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
86#
87
88# CONN RECEPT ANALOG DIGITAL DVI RIGHT ANGLE
89F: dvi-recept-ra
90#
91# - DVI-RECEPT-RA, package drawing, land pattern
92# for example MOLEX 74320-1004
93# http://www.molex.com/pdm_docs/sd/743201004_sd.pdf
94#
95
96# EUS (R-PDSS-T6)
97F: eus
98#
99# - for example: the PTH04000WAH data sheet, it's EUS
100# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
101#
102
103# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
104F: fiducial
105
106# 2 rows of Header with outline for through hole type
107F: he-2row-dip
108#
109# - HE-${n}x2-${px}: for example FCI: the 87606-310LF data sheet, package drawing
110# http://portal.fciconnect.com/res/en/pdffiles/doc_search/87606.pdf
111#
112
113# generic header through hole type
114F: header
115#
116# - HDR-${C}x${R}-$P
117# C --> column number
118# R --> row number
119# P --> pitch
120#
121
122# Header with outline for shrouded wafer for example, SMD type
123F: he-shrouded
124#
125# - he-shrouded-${n}x2pins-${pitch}: for example Molex: the 87832-1420 data sheet, package drawing
126# http://www.molex.com/pdm_docs/sd/878321420_sd.pdf
127#
128
129# IR Receiver Module
130F: ir
131#
132# From Vishay:
133#
134# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
135# http://www.vishay.com/docs/81732/tsop348.pdf
136
137# LED right angle package
138F: ledsmd
139#
140# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
141# http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
142# added a letter 'R' stands for right angle land pattern
143# could expand it as else land pattern for 0603, 0805, 0805R, etc.
144#
145
146# MDIP
147F: mdip
148#
149# From FAIRCHILD:
150#
151# - the 6N138S data sheet
152# http://www.fairchildsemi.com/ds/6N/6N138.pdf
153#
154# Package Type:
155#
156# - MDIP 8L
157# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
158#
159# Package Drawing:
160#
161# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
162
163# Small Size 2.4 GHz PCB Antenna
164# http://focus.ti.com/lit/an/swra117d/swra117d.pdf
165F: meander-2.4GHz
166
167# Microphone, through hole type, bent pins
168F: mic-ra-dip
169#
170# - MIC-RA-DIP-${Dia}x${Height}: for example PRO SIGNAL the MP33125 data sheet, package drawing
171# http://www.farnell.com/datasheets/359234.pdf
172# be noted that placements of two pins based on bending pins to suitable right angle purpose.
173# the py# is the option to change to distance that you want.
174#
175
176# Mini-USB B receptable (SMT; almost generic)
177F: mini_usb_b
178
179# Solder pads and test points
180F: pads
181#
182# - PAD_${type}_$size
183# type --> C: circle, R: round, S: square
184# size --> dimension
185#
186
187# "pads" in typical array formations
188F: pads-array
189
190# "Generic" simple QFN
191F: qfn
192#
193# The information for these packages comes from various sources:
194#
195# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
196# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
197# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
198# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
199# http://www.nxp.com/package/SOT617-1.html
200# http://www.nxp.com/package/SOT617-3.html
201#
202# Solder paste:
203#
204# Footprint Center pad Closest NXP (with complete land pattern)
205# QFN28-Atmel 2.4 mm for further study
206# QFN28-SiLabs 3.3 mm use SiLab's specification
207# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
208# QFN32-VHHD-6 3.4 mm SOT818-1
209#
210# From NXP:
211#
212# Package Pad Paste zone Islands Isl. size Isl. gap
213# SiLabs 3.25 3.1 3 x 3 0.9
214# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
215# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
216#
217# NXP rules (AN10365):
218# - paste zone = 35% of pad area
219# - paste coverge = 20% of pad area
220#
221# Our parameters:
222#
223# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
224# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
225# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
226#
227# Known bugs:
228#
229# - really ought to merge all the various QFN definitions (we have more
230# over at gta02-core) into a single QFN file with a big mean table of
231# everything
232#
233N: sot617-3-lp
234
235# "Generic" simple QFP (for now, just for Silabs' C8051F320)
236F: qfp
237#
238# - the C8051F320 data sheet
239# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
240#
241# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
242# the LQPF48/TQFP48 referred to the same package drawing and land pattern
243#
244# - LQFP48, TQFP48: C48 -> ackage drawping
245# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
246#
247# - LQFP48, TQFP48: C48 -> package land pattern
248# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
249#
250# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
251# http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf
252#
253# - LQFP64, C64 -> package drawing
254# http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
255#
256# - LQFP64, C64 -> package land pattern
257# http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
258#
259# comparisons of pads dimension of WM9707, KS8001, ADV7125
260#
261# MIN NOM MAX chip
262# "b" 0.17mm 0.22mm 0.27mm WM9707
263# 0.19mm 0.22mm 0.25mm KS8001
264# 0.17mm 0.22mm 0.27mm ADV7125
265# "L" 0.45mm 0.6mm 0.75mm WM9707
266# 0.5mm 0.6mm 0.7mm KS8001
267# 0.45mm 0.6mm 0.75mm ADV7125
268#
269# so a combination of both ackage drawping and land pattern from Maxim
270# the lad pattern for QFP48 is 0.27mm for "b", 1.45mm for "L"
271# it should be safe.
272#
273
274# 3.5mm audio stereo phone jack
275F: phonejack
276#
277# phonejack-${size}-${N}
278# From SCPRE:
279#
280# - phonejack-3.5-5, the SCJ368R1NUS0B00G data sheet, drawing
281# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Audio/SCJ368R1NUS0B00G.pdf
282#
283
284# CONN RCA JACK 3-CONs RIGHT ANGLE
285F: rca-3-ra
286#
287# - RCA-3-RA, package drawing, land pattern
288# for example SCPRE SCP662CNS257U00G
289# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/SCP662CNS257U00G.pdf
290#
291
292# RJ45, 8 pins, two leds
293F: rj45
294#
295# - RJ45-8-LED, the 48025-0002 data sheet, drawing, from MOLEX
296# http://www.molex.com/pdm_docs/sd/480250002_sd.pdf
297#
298
299# SOIC
300F: soic
301#
302# From TI:
303#
304# - the SN75HVD12DR data sheet
305# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
306#
307# Package Drawing:
308#
309# - D(JEDEC)
310# - R-PDSO-G8
311# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
312# - R-PDSO-G14
313# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
314# - R-PDSO-G16
315# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
316
317# SOT generic package
318F: sot
319# experimental generic SOT footprint; currently only for
320#
321# - SOT-235, for example, TI SOT-23, DBV(R-PDSO-G5) package
322# http://www.ti.com/lit/ds/symlink/tps76301.pdf
323# - SOT-323 aka SC-70
324# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
325# - SOT-363 aka SC-88 aka SC-70-6
326# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
327# - SOT-523
328# http://www.diodes.com/datasheets/ds31784.pdf
329# - SOT-563
330# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
331#
332# some conflicts with the outline exist
333
334# SOT23 generic package with counter-clockweise or clockwise pin assignment
335F: sot23
336#
337# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
338# http://www.diodes.com/datasheets/APX803.pdf
339#
340# for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
341# http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
342#
343
344# Standard rectangular passive components
345F: stdpass
346#
347# packages: 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512
348# polarized(marked the cathode) packages: starts from 0603P to 2512P
349#
350# be noticed that 1812 land pattern based on a p/n: miniSMDC200F from Tycoelectronics
351# http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Catalog+Section%7FSURFACE-MOUNT%7FA1%7Fpdf%7FEnglish%7FENG_CS_SURFACE-MOUNT_A1.pdf%7FRF1410-000
352#
353
354# SOT-323 package with counter-clockweise or clockwise pin assignment
355F: sot-323
356N: mmst3904
357
358# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
359# http://www.nxp.com/packages/SOT341-1.html
360# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
361
362# mechanical mounting holes
363F: spacer
364#
365# - SPACER-$nominal-$disc-$keepout$type
366# nominal --> hole dia.
367# disc --> copper dia.
368# keepout --> keepout dia.
369# type --> "-BARE" : no copper area
370# --> "" : with copper area
371#
372
373# "Generic" simple SSOP
374F: ssop
375#
376# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
377# http://www.micrel.com/_PDF/mic2550a.pdf
378#
379# - TSSOP14: from NXP -> package land pattern
380# http://www.nxp.com/packages/SOT402-1.html
381# http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf
382
383# SWITCH, TACTILE, SPST, R/A, THROUGH HOLE
384F: tactile-sw-spst-ra-dip.fpd
385#
386# - TACTIL-SW-${TYPE}-RA-${A}-${B}, package drawing, land pattern
387# for example TYCO ELECTRONICS FSMRA2JH
388# http://www.farnell.com/datasheets/51343.pdf
389#
390
391# "Generic" simple TO-252, TO-263
392F: to
393#
394# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
395# http://www.ti.com/lit/ds/symlink/lp38690.pdf
396#
397# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
398# http://www.national.com/packaging/mkt/td03b.pdf
399#
400# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
401# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
402#
403# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
404# http://www.national.com/packaging/mkt/tj5a.pdf
405#
406
407# "Generic" simple TSOP
408F: tsop
409#
410# - TSOP28: Z28 -> package drawing
411# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
412#
413# - TSOP28: Z28 -> package land pattern
414# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
415#
416# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
417# the TSOP32 referred to the same package drawing and land pattern
418#
419# - TSOP32: Z32 -> package drawing
420# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
421#
422# - TSOP32: Z32 -> package land pattern
423# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
424#
425# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
426# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
427#
428# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
429# http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf
430#
431# - TSOP66: currently referred to M1rc3 design files land pattern:
432# width of pad -> 0.4 mm, it's rectangle not round one
433# length of pad -> 1.25 mm
434# Width of body -> 400 mil
435
436# TSSOP5 for NXP
437F: tssop5
438#
439# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet,
440# http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
441# http://www.nxp.com/packages/SOT353-1.html
442# but without real land pattern found, still could refer link below for more in details:
443# http://www.nxp.com/documents/application_note/AN10365.pdf
444#
445# also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
446# they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
447#
448# NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
449# could use a land pattern of pad length to be 0.7 mm.
450#
451
452# USB DUAL STACKED A RECEPT CON R/A
453# F: usb-a-dual-recept-r
454#
455# - USB-A-DUAL-RECEPT-RA, package drawing, land pattern
456# for example MOLEX 67298-4090
457# http://www.molex.com/pdm_docs/sd/672984090_sd.pdf
458#
459
460# USB A plug for SMT
461#
462# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
463# 0.1 mm with respect to the reference.
464#
465# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
466# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
467# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
468# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
469# 3.5 mm.
470#
471# Assuming that the pad is intended to extend a bit beyond the lead, we need
472# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
473# be intended to be used this way, however, we still have to consider small
474# errors in registration, which also amount to about 0.1 mm, so the calculation
475# remains valid.)
476#
477F: usb_a_plug_smt
478
479# USB 2.0 from usb_20_040908, page 99
480F: usb-a-pcb
481
482# XLR, SOCKET, PANEL, HORIZ/PCB
483F: xlr-socket
484#
485# - XLR-PANEL-HORIZ/PCB-SOCKET, package drawing, land pattern
486# for example NEUTRIK NC3FAH1
487# http://www.neutrik.us/en-us/xlr/a-series/nc3fah1
488#
489
490# XLR, PLUG, PANEL, HORIZ/PCB
491F: xlr-plug
492#
493# - XLR-PANEL-HORIZ/PCB-PLUG, package drawing, land pattern
494# for example NEUTRIK NC3MAH
495# http://www.neutrik.us/en-us/xlr/a-series/nc3mah
496#
497
498# 2-pins rectangular smd xtal
499F: xtal-2
500#
501# - xtal2-11.5mmx4.83mm package drawing, land pattern
502# for example R49SSA-028636-F20-YYY-YQA
503# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf
504#
505
506# 4-pins rectangular smd xtal
507F: xtal-4
508#
509# - xtal4-3.2mmx2.5mm package drawing, land pattern
510# for example NX3225SA
511# http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf
512#
513# - xtal4-5mmx3.2mm package drawing, land pattern
514# for example SO5032-050000-O3A-BBE-QA
515# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/FPGA/Qi%20Hardware%20SO5032-050000-O3A-BBE-QA.pdf
516#
517# - xtal4-6mmx3.6mm package drawing, land pattern
518# for example ABMM2-24.576MHZ-E2-T
519# http://www.abracon.com/Resonators/ABMM2.pdf
520#
521
522# DIP4 component in a DIP6 socket
523F: dip4of6
524#
525# The smallest DIP socket commonly available is DIP6, but there are some
526# components that come in a DIP4 package.
527#
528
529# Micro-USB B receptacle, standard (bottom) mount (all SMT, no posts)
530F: zx62-b-5pa
531#
532# Hirose ZX62-B-5PA(11)
533# http://www.hirose.co.jp/cataloge_hp/e24200011.pdf
534#
535# Compatible (front pads are slightly narrower in recommended footprint):
536# FCI 10118192-0001LF
537# http://portal.fciconnect.com/Comergent//fci/drawing/10118192.pdf
538#
539
540# Micro-USB B receptacle, mid-mount (all SMT, no posts)
541F: zx62m-b-5p
542#
543# Known issue:
544# Rear side pads should have an empty corner. Right now, we even print silk
545# screen on them.
546#
547# Hirose ZX62M-B-5P(01)
548# http://www.hirose.co.jp/cataloge_hp/e24200011.pdf
549#
550

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