Root/modules/INFO

Source at commit 71a66c7d94a0d6acd6ca631c7e2bd3d07968aed4 created 10 years 2 months ago.
By Adam Wang, c-smd.fpd: added packages for SMD Aluminum Electrolytic Capacitors
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# Printed 8:10 card contacs
9F: 8_10-card
10
11# Open clip for AA batteries, through-hole
12# http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf
13# Note: should generalize this for AAA and maybe also larger sizes
14F: bat-clip-aa-th
15
16# BGA
17F: bga
18# - 484-Pin FineLine BGA(FBGA), from Altera
19# http://www.altera.com/devicepackaging/04R00416-02.pdf
20#
21# - FG(G)484 Fine-Pitch BGA, from Xilinx
22# http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
23#
24
25# Chip SMD Aluminum Electrolytic Capacitors
26F: c-smd
27#
28# for example 10TZV220M6.3X8 from RUBYCON
29#
30# - c-smd-5mmx6.1mm, c-smd-6.3mmx8mm, c-smd-8mmx10.5mm, c-smd-10mmx10.5mm
31#
32# package drawing
33# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/e_TZV.pdf
34#
35# land pattern
36# http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/Chip_Alumi_Eng.pdf
37#
38
39# DO-214
40F: do-214
41#
42# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
43# http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
44#
45# - DO-214AB(SMC), from Fairchild
46# http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
47#
48# - DO-214AC(SMA), from Fairchild
49# http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
50#
51
52# EUS (R-PDSS-T6)
53F: eus
54#
55# - for example: the PTH04000WAH data sheet, it's EUS
56# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
57#
58
59# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
60F: fiducial
61
62# IR Receiver Module
63F: ir
64#
65# From Vishay:
66#
67# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
68# http://www.vishay.com/docs/81732/tsop348.pdf
69
70# LED right angle package
71F: ledsmd
72#
73# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
74# http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
75# added a letter 'R' stands for right angle land pattern
76# could expand it as else land pattern for 0603, 0805, 0805R, etc.
77#
78
79# MDIP
80F: mdip
81#
82# From FAIRCHILD:
83#
84# - the 6N138S data sheet
85# http://www.fairchildsemi.com/ds/6N/6N138.pdf
86#
87# Package Type:
88#
89# - MDIP 8L
90# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
91#
92# Package Drawing:
93#
94# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
95
96# Mini-USB B receptable (SMT; almost generic)
97F: mini_usb_b
98
99# Solder pads and test points
100F: pads
101
102# "Generic" simple QFN
103F: qfn
104#
105# The information for these packages comes from various sources:
106#
107# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
108# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
109# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
110# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
111# http://www.nxp.com/package/SOT617-1.html
112# http://www.nxp.com/package/SOT617-3.html
113#
114# Solder paste:
115#
116# Footprint Center pad Closest NXP (with complete land pattern)
117# QFN28-Atmel 2.4 mm for further study
118# QFN28-SiLabs 3.3 mm use SiLab's specification
119# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
120# QFN32-VHHD-6 3.4 mm SOT818-1
121#
122# From NXP:
123#
124# Package Pad Paste zone Islands Isl. size Isl. gap
125# SiLabs 3.25 3.1 3 x 3 0.9
126# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
127# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
128#
129# NXP rules (AN10365):
130# - paste zone = 35% of pad area
131# - paste coverge = 20% of pad area
132#
133# Our parameters:
134#
135# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
136# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
137# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
138#
139# Known bugs:
140#
141# - really ought to merge all the various QFN definitions (we have more
142# over at gta02-core) into a single QFN file with a big mean table of
143# everything
144#
145N: sot617-3-lp
146
147# "Generic" simple QFP (for now, just for Silabs' C8051F320)
148F: qfp
149#
150# - the C8051F320 data sheet
151# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
152#
153# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
154# the LQPF48/TQFP48 referred to the same package drawing and land pattern
155#
156# - LQFP48, TQFP48: C48 -> package drawing
157# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
158#
159# - LQFP48, TQFP48: C48 -> package land pattern
160# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
161#
162# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
163# http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf
164#
165# - LQFP64, C64 -> package drawing
166# http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
167#
168# - LQFP64, C64 -> package land pattern
169# http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
170#
171
172# SOIC
173F: soic
174#
175# From TI:
176#
177# - the SN75HVD12DR data sheet
178# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
179#
180# Package Drawing:
181#
182# - D(JEDEC)
183# - R-PDSO-G8
184# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
185# - R-PDSO-G14
186# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
187# - R-PDSO-G16
188# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
189
190# SOT generic package
191F: sot
192# experimental generic SOT footprint; currently only for
193#
194# - SOT-323 aka SC-70
195# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
196# - SOT-363 aka SC-88 aka SC-70-6
197# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
198# - SOT-523
199# http://www.diodes.com/datasheets/ds31784.pdf
200# - SOT-563
201# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
202#
203# some conflicts with the outline exist
204
205# SOT23 generic package with counter-clockweise or clockwise pin assignment
206F: sot23
207#
208# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
209# http://www.diodes.com/datasheets/APX803.pdf
210#
211# for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
212# http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
213#
214
215# Standard rectangular passive components
216F: stdpass
217#
218# packages: 0201, 0402, 0603, 0805, 1206, 1210, 2010, 2512
219# polarized(marked the cathode) packages: starts from 0603P to 2512P
220#
221
222# SOT-323 package with counter-clockweise or clockwise pin assignment
223F: sot-323
224N: mmst3904
225
226# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
227# http://www.nxp.com/packages/SOT341-1.html
228# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
229
230# "Generic" simple SSOP
231F: ssop
232#
233# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
234# http://www.micrel.com/_PDF/mic2550a.pdf
235#
236# - TSSOP14: from NXP -> package land pattern
237# http://www.nxp.com/packages/SOT402-1.html
238# http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf
239
240# "Generic" simple TO-252, TO-263
241F: to
242#
243# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
244# http://www.ti.com/lit/ds/symlink/lp38690.pdf
245#
246# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
247# http://www.national.com/packaging/mkt/td03b.pdf
248#
249# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
250# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
251#
252# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
253# http://www.national.com/packaging/mkt/tj5a.pdf
254#
255
256# "Generic" simple TSOP
257F: tsop
258#
259# - TSOP28: Z28 -> package drawing
260# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
261#
262# - TSOP28: Z28 -> package land pattern
263# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
264#
265# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
266# the TSOP32 referred to the same package drawing and land pattern
267#
268# - TSOP32: Z32 -> package drawing
269# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
270#
271# - TSOP32: Z32 -> package land pattern
272# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
273#
274# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
275# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
276#
277# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
278# http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf
279#
280# - TSOP66: currently referred to M1rc3 design files land pattern:
281# width of pad -> 0.4 mm, it's rectangle not round one
282# length of pad -> 1.25 mm
283# Width of body -> 400 mil
284
285# TSSOP5 for NXP
286F: tssop5
287#
288# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet,
289# http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
290# http://www.nxp.com/packages/SOT353-1.html
291# but without real land pattern found, still could refer link below for more in details:
292# http://www.nxp.com/documents/application_note/AN10365.pdf
293#
294# also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
295# they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
296#
297# NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
298# could use a land pattern of pad length to be 0.7 mm.
299#
300
301# USB A plug for SMT
302#
303# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
304# 0.1 mm with respect to the reference.
305#
306# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
307# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
308# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
309# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
310# 3.5 mm.
311#
312# Assuming that the pad is intended to extend a bit beyond the lead, we need
313# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
314# be intended to be used this way, however, we still have to consider small
315# errors in registration, which also amount to about 0.1 mm, so the calculation
316# remains valid.)
317#
318F: usb_a_plug_smt
319
320# USB 2.0 from usb_20_040908, page 99
321F: usb-a-pcb
322
323# 2-pins rectangular smd xtal
324F: xtal-2
325#
326# - xtal2-11.5mmx4.83mm package drawing, land pattern
327# for example R49SSA-028636-F20-YYY-YQA
328# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf
329#
330
331# 4-pins rectangular smd xtal
332F: xtal-4
333#
334# - xtal4-3.2mmx2.5mm package drawing, land pattern
335# for example NX3225SA
336# http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf
337#
338# - xtal4-5mmx3.2mm package drawing, land pattern
339# for example SO5032-050000-O3A-BBE-QA
340# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/FPGA/Qi%20Hardware%20SO5032-050000-O3A-BBE-QA.pdf
341#
342# - xtal4-6mmx3.6mm package drawing, land pattern
343# for example ABMM2-24.576MHZ-E2-T
344# http://www.abracon.com/Resonators/ABMM2.pdf
345#
346
347

Archive Download this file

Branches:
master



interactive