Root/modules/INFO

Source at commit b8f4df391b7894c400b1028662667f2082472b58 created 9 years 7 months ago.
By Adam Wang, added to-252 link
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# Standard rectangular passive components
9F: stdpass
10
11# Solder pads and test points
12F: pads
13
14# Printed 8:10 card contacs
15F: 8_10-card
16
17# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
18F: fiducial
19
20# "Generic" simple QFN
21F: qfn
22#
23# The information for these packages comes from various sources:
24#
25# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
26# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
27# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
28# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
29# http://www.nxp.com/package/SOT617-1.html
30# http://www.nxp.com/package/SOT617-3.html
31#
32# Solder paste:
33#
34# Footprint Center pad Closest NXP (with complete land pattern)
35# QFN28-Atmel 2.4 mm for further study
36# QFN28-SiLabs 3.3 mm use SiLab's specification
37# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
38# QFN32-VHHD-6 3.4 mm SOT818-1
39#
40# From NXP:
41#
42# Package Pad Paste zone Islands Isl. size Isl. gap
43# SiLabs 3.25 3.1 3 x 3 0.9
44# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
45# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
46#
47# NXP rules (AN10365):
48# - paste zone = 35% of pad area
49# - paste coverge = 20% of pad area
50#
51# Our parameters:
52#
53# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
54# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
55# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
56#
57# Known bugs:
58#
59# - really ought to merge all the various QFN definitions (we have more
60# over at gta02-core) into a single QFN file with a big mean table of
61# everything
62#
63N: sot617-3-lp
64
65# "Generic" simple QFP (for now, just for Silabs' C8051F320)
66F: qfp
67#
68# - the C8051F320 data sheet
69# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
70#
71# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
72# the LQPF48/TQFP48 referred to the same package drawing and land pattern
73#
74# - LQFP48, TQFP48: C48 -> package drawing
75# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
76#
77# - LQFP48, TQFP48: C48 -> package land pattern
78# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
79#
80
81# Mini-USB B receptable (SMT; almost generic)
82F: mini_usb_b
83
84# USB A plug for SMT
85#
86# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
87# 0.1 mm with respect to the reference.
88#
89# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
90# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
91# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
92# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
93# 3.5 mm.
94#
95# Assuming that the pad is intended to extend a bit beyond the lead, we need
96# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
97# be intended to be used this way, however, we still have to consider small
98# errors in registration, which also amount to about 0.1 mm, so the calculation
99# remains valid.)
100#
101F: usb_a_plug_smt
102
103# USB 2.0 from usb_20_040908, page 99
104F: usb-a-pcb
105
106# SOT-323 package with counter-clockweise or clockwise pin assignment
107F: sot-323
108N: mmst3904
109
110# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
111# http://www.nxp.com/packages/SOT341-1.html
112# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
113F: ssop
114
115# experimental generic SOT footprint; currently only for
116#
117# - SOT-323 aka SC-70
118# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
119# - SOT-363 aka SC-88 aka SC-70-6
120# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
121# - SOT-523
122# http://www.diodes.com/datasheets/ds31784.pdf
123# - SOT-563
124# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
125#
126# some conflicts with the outline exist
127
128F: sot
129
130# MDIP
131F: mdip
132#
133# From FAIRCHILD:
134#
135# - the 6N138S data sheet
136# http://www.fairchildsemi.com/ds/6N/6N138.pdf
137#
138# Package Type:
139#
140# - MDIP 8L
141# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
142#
143# Package Drawing:
144#
145# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
146
147# SOIC
148F: soic
149#
150# From TI:
151#
152# - the SN75HVD12DR data sheet
153# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
154#
155# Package Drawing:
156#
157# - D(JEDEC)
158# - R-PDSO-G8
159# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
160# - R-PDSO-G14
161# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
162# - R-PDSO-G16
163# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
164
165# IR Receiver Module
166F: ir
167#
168# From Vishay:
169#
170# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
171# http://www.vishay.com/docs/81732/tsop348.pdf
172
173# "Generic" simple TSOP
174F: tsop
175#
176# - the JS28F256J3F105 data sheet, it's TSOP-56
177# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
178#
179# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
180# the TSOP32 referred to the same package drawing and land pattern
181#
182# - TSOP28: Z28 -> package drawing
183# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
184#
185# - TSOP28: Z28 -> package land pattern
186# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
187#
188#
189# - TSOP32: Z32 -> package drawing
190# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
191#
192# - TSOP32: Z32 -> package land pattern
193# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
194#
195
196# "Generic" simple TO-252
197F: to-252
198#
199# - for example: the LP38690DT-3.3 data sheet, it's TO-252
200# http://www.ti.com/lit/ds/symlink/lp38690.pdf
201#
202# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
203# http://www.national.com/packaging/mkt/td03b.pdf
204#
205
206

Archive Download this file

Branches:
master



interactive