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Source at commit c05a603a4b1c7d9ec4b6fe69cd6cae3fb5fdeb3e created 7 years 5 months ago.
By Adam Wang, stdpass.fpd: added a cathode for polarized variants(xxxxP) started from 0603
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# Printed 8:10 card contacs
9F: 8_10-card
10
11# BGA
12F: bga
13# - 484-Pin FineLine BGA(FBGA), from Altera
14# http://www.altera.com/devicepackaging/04R00416-02.pdf
15#
16# - FG(G)484 Fine-Pitch BGA, from Xilinx
17# http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
18#
19
20# DO-214
21F: do-214
22#
23# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
24# http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
25#
26# - DO-214AB(SMC), from Fairchild
27# http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
28#
29# - DO-214AC(SMA), from Fairchild
30# http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
31#
32
33# EUS (R-PDSS-T6)
34F: eus
35#
36# - for example: the PTH04000WAH data sheet, it's EUS
37# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
38#
39
40# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
41F: fiducial
42
43# IR Receiver Module
44F: ir
45#
46# From Vishay:
47#
48# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
49# http://www.vishay.com/docs/81732/tsop348.pdf
50
51# LED right angle package
52F: ledsmd
53#
54# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
55# http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
56# added a letter 'R' stands for right angle land pattern
57# could expand it as else land pattern for 0603, 0805, 0805R, etc.
58#
59
60# MDIP
61F: mdip
62#
63# From FAIRCHILD:
64#
65# - the 6N138S data sheet
66# http://www.fairchildsemi.com/ds/6N/6N138.pdf
67#
68# Package Type:
69#
70# - MDIP 8L
71# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
72#
73# Package Drawing:
74#
75# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
76
77# Mini-USB B receptable (SMT; almost generic)
78F: mini_usb_b
79
80# Solder pads and test points
81F: pads
82
83# "Generic" simple QFN
84F: qfn
85#
86# The information for these packages comes from various sources:
87#
88# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
89# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
90# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
91# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
92# http://www.nxp.com/package/SOT617-1.html
93# http://www.nxp.com/package/SOT617-3.html
94#
95# Solder paste:
96#
97# Footprint Center pad Closest NXP (with complete land pattern)
98# QFN28-Atmel 2.4 mm for further study
99# QFN28-SiLabs 3.3 mm use SiLab's specification
100# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
101# QFN32-VHHD-6 3.4 mm SOT818-1
102#
103# From NXP:
104#
105# Package Pad Paste zone Islands Isl. size Isl. gap
106# SiLabs 3.25 3.1 3 x 3 0.9
107# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
108# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
109#
110# NXP rules (AN10365):
111# - paste zone = 35% of pad area
112# - paste coverge = 20% of pad area
113#
114# Our parameters:
115#
116# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
117# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
118# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
119#
120# Known bugs:
121#
122# - really ought to merge all the various QFN definitions (we have more
123# over at gta02-core) into a single QFN file with a big mean table of
124# everything
125#
126N: sot617-3-lp
127
128# "Generic" simple QFP (for now, just for Silabs' C8051F320)
129F: qfp
130#
131# - the C8051F320 data sheet
132# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
133#
134# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
135# the LQPF48/TQFP48 referred to the same package drawing and land pattern
136#
137# - LQFP48, TQFP48: C48 -> package drawing
138# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
139#
140# - LQFP48, TQFP48: C48 -> package land pattern
141# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
142#
143# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
144# http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf
145#
146# - LQFP64, C64 -> package drawing
147# http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
148#
149# - LQFP64, C64 -> package land pattern
150# http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
151#
152
153# SOIC
154F: soic
155#
156# From TI:
157#
158# - the SN75HVD12DR data sheet
159# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
160#
161# Package Drawing:
162#
163# - D(JEDEC)
164# - R-PDSO-G8
165# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
166# - R-PDSO-G14
167# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
168# - R-PDSO-G16
169# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
170
171# SOT generic package
172F: sot
173# experimental generic SOT footprint; currently only for
174#
175# - SOT-323 aka SC-70
176# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
177# - SOT-363 aka SC-88 aka SC-70-6
178# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
179# - SOT-523
180# http://www.diodes.com/datasheets/ds31784.pdf
181# - SOT-563
182# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
183#
184# some conflicts with the outline exist
185
186# SOT23 generic package with counter-clockweise or clockwise pin assignment
187F: sot23
188#
189# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
190# http://www.diodes.com/datasheets/APX803.pdf
191#
192# for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
193# http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
194#
195
196# Standard rectangular passive components
197F: stdpass
198#
199# packages: 0201, 0402, 0603, 0805, 1206, 1210, 2010, 2512
200# polarized(marked the cathode) packages: starts from 0603P to 2512P
201#
202
203# SOT-323 package with counter-clockweise or clockwise pin assignment
204F: sot-323
205N: mmst3904
206
207# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
208# http://www.nxp.com/packages/SOT341-1.html
209# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
210
211# "Generic" simple SSOP
212F: ssop
213#
214# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
215# http://www.micrel.com/_PDF/mic2550a.pdf
216#
217# - TSSOP14: from NXP -> package land pattern
218# http://www.nxp.com/packages/SOT402-1.html
219# http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf
220
221# "Generic" simple TO-252, TO-263
222F: to
223#
224# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
225# http://www.ti.com/lit/ds/symlink/lp38690.pdf
226#
227# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
228# http://www.national.com/packaging/mkt/td03b.pdf
229#
230# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
231# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
232#
233# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
234# http://www.national.com/packaging/mkt/tj5a.pdf
235#
236
237# "Generic" simple TSOP
238F: tsop
239#
240# - TSOP28: Z28 -> package drawing
241# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
242#
243# - TSOP28: Z28 -> package land pattern
244# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
245#
246# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
247# the TSOP32 referred to the same package drawing and land pattern
248#
249# - TSOP32: Z32 -> package drawing
250# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
251#
252# - TSOP32: Z32 -> package land pattern
253# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
254#
255# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
256# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
257#
258# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
259# http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf
260#
261# - TSOP66: currently referred to M1rc3 design files land pattern:
262# width of pad -> 0.4 mm, it's rectangle not round one
263# length of pad -> 1.25 mm
264# Width of body -> 400 mil
265
266# TSSOP5 for NXP
267F: tssop5
268#
269# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet,
270# http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
271# http://www.nxp.com/packages/SOT353-1.html
272# but without real land pattern found, still could refer link below for more in details:
273# http://www.nxp.com/documents/application_note/AN10365.pdf
274#
275# also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
276# they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
277#
278# NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
279# could use a land pattern of pad length to be 0.7 mm.
280#
281
282# USB A plug for SMT
283#
284# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
285# 0.1 mm with respect to the reference.
286#
287# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
288# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
289# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
290# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
291# 3.5 mm.
292#
293# Assuming that the pad is intended to extend a bit beyond the lead, we need
294# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
295# be intended to be used this way, however, we still have to consider small
296# errors in registration, which also amount to about 0.1 mm, so the calculation
297# remains valid.)
298#
299F: usb_a_plug_smt
300
301# USB 2.0 from usb_20_040908, page 99
302F: usb-a-pcb
303
304
305

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