KiCad Libraries
Sign in or create your account | Project List | Help
KiCad Libraries Git Source Tree
Root/
Source at commit c456f08cb11a8507a196163092df4f9a8188847f created 11 years 9 months ago. By Adam Wang, tactile-sw-spst-ra-dip.fpd: added package of TACTIL-SW-${TYPE}-RA-${A}-${B} | |
---|---|
1 | # |
2 | # Tags: |
3 | # |
4 | # F Footprint name (must be first) |
5 | # N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F) |
6 | # |
7 | |
8 | # Printed 8:10 card contacs |
9 | F: 8_10-card |
10 | |
11 | # Open clip for AA batteries, through-hole |
12 | # http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf |
13 | # Note: should generalize this for AAA and maybe also larger sizes |
14 | F: bat-clip-aa-th |
15 | |
16 | # 8:10 Card Socket Connectors RIGHT ANGLE SMT Hinge Type |
17 | F: 8_10-socket-ra |
18 | # |
19 | # - 8:10-SOCKET-RA, package drawing, land pattern |
20 | # for example MOLEX 500901-0801 |
21 | # http://www.molex.com/pdm_docs/sd/5009010801_sd.pdf |
22 | # |
23 | |
24 | # BGA |
25 | F: bga |
26 | # - 484-Pin FineLine BGA(FBGA), from Altera |
27 | # http://www.altera.com/devicepackaging/04R00416-02.pdf |
28 | # |
29 | # - FG(G)484 Fine-Pitch BGA, from Xilinx |
30 | # http://www.xilinx.com/support/documentation/user_guides/ug385.pdf |
31 | # |
32 | |
33 | # Chip SMD Aluminum Electrolytic Capacitors |
34 | F: c-smd |
35 | # |
36 | # for example 10TZV220M6.3X8 from RUBYCON |
37 | # |
38 | # - c-smd-5mmx6.1mm, c-smd-6.3mmx8mm, c-smd-8mmx10.5mm, c-smd-10mmx10.5mm |
39 | # |
40 | # package drawing |
41 | # http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/e_TZV.pdf |
42 | # |
43 | # land pattern |
44 | # http://www.rubycon.co.jp/en/catalog/e_pdfs/aluminum/Chip_Alumi_Eng.pdf |
45 | # |
46 | |
47 | # Chip SMD Tantalum Capacitors |
48 | F: c-t-smd |
49 | # |
50 | # for example T520B157M006ATE070 from KEMET |
51 | # |
52 | # - TC-$Case-$EIA-$Density |
53 | # the density is based on the conditions outlined in IPC standard 7351 (IPC-7351). |
54 | # |
55 | # package drawing ( page 62 ), land pattern ( page 73 ) |
56 | # http://www.kemet.com/kemet/web/homepage/kechome.nsf/vapubfiles/KEM_TC102_LOWESR.pdf/$file/KEM_TC102_LOWESR.pdf |
57 | # |
58 | |
59 | # SOCKET, PCB, DC POWER JACK |
60 | F: dcjack |
61 | # |
62 | # - DCJACK-${L}x${W}, package drawing, land pattern |
63 | # for example SCPRE SCD441CPS011B00G |
64 | # http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Supply/SCD441CPS011B00G.pdf |
65 | # |
66 | |
67 | # SOCKET, DIN, PCB, 180, 5PIN, 5WAYS, 45 DEGREE |
68 | F: din-5 |
69 | # |
70 | # - DIN-SOCKET-PCB-5-45, package drawing, land pattern |
71 | # for example DELTRON 671-0500 |
72 | # http://www.farnell.com/datasheets/65433.pdf |
73 | # |
74 | |
75 | # DO-214 |
76 | F: do-214 |
77 | # |
78 | # - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it |
79 | # http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf |
80 | # |
81 | # - DO-214AB(SMC), from Fairchild |
82 | # http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf |
83 | # |
84 | # - DO-214AC(SMA), from Fairchild |
85 | # http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf |
86 | # |
87 | |
88 | # CONN RECEPT ANALOG DIGITAL DVI RIGHT ANGLE |
89 | F: dvi-recept-ra |
90 | # |
91 | # - DVI-RECEPT-RA, package drawing, land pattern |
92 | # for example MOLEX 74320-1004 |
93 | # http://www.molex.com/pdm_docs/sd/743201004_sd.pdf |
94 | # |
95 | |
96 | # EUS (R-PDSS-T6) |
97 | F: eus |
98 | # |
99 | # - for example: the PTH04000WAH data sheet, it's EUS |
100 | # http://www.ti.com/lit/ds/symlink/pth04000w.pdf |
101 | # |
102 | |
103 | # Fiducial (1 mm copper pad, 2 mm solder mask clearance) |
104 | F: fiducial |
105 | |
106 | # 2 rows of Header with outline for through hole type |
107 | F: he-2row-dip |
108 | # |
109 | # - HE-${n}x2-${px}: for example FCI: the 87606-310LF data sheet, package drawing |
110 | # http://portal.fciconnect.com/res/en/pdffiles/doc_search/87606.pdf |
111 | # |
112 | |
113 | # Header with outline for shrouded wafer for example, SMD type |
114 | F: he-shrouded |
115 | # |
116 | # - he-shrouded-${n}x2pins-${pitch}: for example Molex: the 87832-1420 data sheet, package drawing |
117 | # http://www.molex.com/pdm_docs/sd/878321420_sd.pdf |
118 | # |
119 | |
120 | # IR Receiver Module |
121 | F: ir |
122 | # |
123 | # From Vishay: |
124 | # |
125 | # - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet |
126 | # http://www.vishay.com/docs/81732/tsop348.pdf |
127 | |
128 | # LED right angle package |
129 | F: ledsmd |
130 | # |
131 | # - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing |
132 | # http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf |
133 | # added a letter 'R' stands for right angle land pattern |
134 | # could expand it as else land pattern for 0603, 0805, 0805R, etc. |
135 | # |
136 | |
137 | # MDIP |
138 | F: mdip |
139 | # |
140 | # From FAIRCHILD: |
141 | # |
142 | # - the 6N138S data sheet |
143 | # http://www.fairchildsemi.com/ds/6N/6N138.pdf |
144 | # |
145 | # Package Type: |
146 | # |
147 | # - MDIP 8L |
148 | # http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08 |
149 | # |
150 | # Package Drawing: |
151 | # |
152 | # http://www.fairchildsemi.com/dwg/N0/N08H.pdf |
153 | |
154 | # Small Size 2.4 GHz PCB Antenna |
155 | # http://focus.ti.com/lit/an/swra117d/swra117d.pdf |
156 | F: meander-2.4GHz |
157 | |
158 | # Microphone, through hole type, bent pins |
159 | F: mic-ra-dip |
160 | # |
161 | # - MIC-RA-DIP-${Dia}x${Height}: for example PRO SIGNAL the MP33125 data sheet, package drawing |
162 | # http://www.farnell.com/datasheets/359234.pdf |
163 | # be noted that placements of two pins based on bending pins to suitable right angle purpose. |
164 | # the py# is the option to change to distance that you want. |
165 | # |
166 | |
167 | # Mini-USB B receptable (SMT; almost generic) |
168 | F: mini_usb_b |
169 | |
170 | # Solder pads and test points |
171 | F: pads |
172 | |
173 | # "pads" in typical array formations |
174 | F: pads-array |
175 | |
176 | # "Generic" simple QFN |
177 | F: qfn |
178 | # |
179 | # The information for these packages comes from various sources: |
180 | # |
181 | # - the C8051F326 data sheet, for the QFN28 footprint (N: mcu) |
182 | # - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx) |
183 | # - Atmel's general recommendations for QFN land patterns (N: atmel-qfn) |
184 | # - NXP's SOT617-1 and SOT617-3, for package and land pattern: |
185 | # http://www.nxp.com/package/SOT617-1.html |
186 | # http://www.nxp.com/package/SOT617-3.html |
187 | # |
188 | # Solder paste: |
189 | # |
190 | # Footprint Center pad Closest NXP (with complete land pattern) |
191 | # QFN28-Atmel 2.4 mm for further study |
192 | # QFN28-SiLabs 3.3 mm use SiLab's specification |
193 | # QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1 |
194 | # QFN32-VHHD-6 3.4 mm SOT818-1 |
195 | # |
196 | # From NXP: |
197 | # |
198 | # Package Pad Paste zone Islands Isl. size Isl. gap |
199 | # SiLabs 3.25 3.1 3 x 3 0.9 |
200 | # SOT818-1 3.4 1.75 2 x 2 0.75 0.25 |
201 | # SOT788-1 4.0 2.4 3 x 3 0.6 0.3 |
202 | # |
203 | # NXP rules (AN10365): |
204 | # - paste zone = 35% of pad area |
205 | # - paste coverge = 20% of pad area |
206 | # |
207 | # Our parameters: |
208 | # |
209 | # Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage |
210 | # QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20% |
211 | # QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19% |
212 | # |
213 | # Known bugs: |
214 | # |
215 | # - really ought to merge all the various QFN definitions (we have more |
216 | # over at gta02-core) into a single QFN file with a big mean table of |
217 | # everything |
218 | # |
219 | N: sot617-3-lp |
220 | |
221 | # "Generic" simple QFP (for now, just for Silabs' C8051F320) |
222 | F: qfp |
223 | # |
224 | # - the C8051F320 data sheet |
225 | # http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf |
226 | # |
227 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
228 | # the LQPF48/TQFP48 referred to the same package drawing and land pattern |
229 | # |
230 | # - LQFP48, TQFP48: C48 -> package drawing |
231 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF |
232 | # |
233 | # - LQFP48, TQFP48: C48 -> package land pattern |
234 | # http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF |
235 | # |
236 | # - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing |
237 | # http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf |
238 | # |
239 | # - LQFP64, C64 -> package drawing |
240 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF |
241 | # |
242 | # - LQFP64, C64 -> package land pattern |
243 | # http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF |
244 | # |
245 | |
246 | # 3.5mm audio stereo phone jack |
247 | F: phonejack |
248 | # |
249 | # phonejack-${size}-${N} |
250 | # From SCPRE: |
251 | # |
252 | # - phonejack-3.5-5, the SCJ368R1NUS0B00G data sheet, drawing |
253 | # http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/Audio/SCJ368R1NUS0B00G.pdf |
254 | # |
255 | |
256 | # CONN RCA JACK 3-CONs RIGHT ANGLE |
257 | F: rca-3-ra |
258 | # |
259 | # - RCA-3-RA, package drawing, land pattern |
260 | # for example SCPRE SCP662CNS257U00G |
261 | # http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/SCP662CNS257U00G.pdf |
262 | # |
263 | |
264 | # RJ45, 8 pins, two leds |
265 | F: rj45 |
266 | # |
267 | # - RJ45-8-LED, the 48025-0002 data sheet, drawing, from MOLEX |
268 | # http://www.molex.com/pdm_docs/sd/480250002_sd.pdf |
269 | # |
270 | |
271 | # SOIC |
272 | F: soic |
273 | # |
274 | # From TI: |
275 | # |
276 | # - the SN75HVD12DR data sheet |
277 | # http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf |
278 | # |
279 | # Package Drawing: |
280 | # |
281 | # - D(JEDEC) |
282 | # - R-PDSO-G8 |
283 | # http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf |
284 | # - R-PDSO-G14 |
285 | # http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf |
286 | # - R-PDSO-G16 |
287 | # http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf |
288 | |
289 | # SOT generic package |
290 | F: sot |
291 | # experimental generic SOT footprint; currently only for |
292 | # |
293 | # - SOT-323 aka SC-70 |
294 | # http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF |
295 | # - SOT-363 aka SC-88 aka SC-70-6 |
296 | # http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF |
297 | # - SOT-523 |
298 | # http://www.diodes.com/datasheets/ds31784.pdf |
299 | # - SOT-563 |
300 | # http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF |
301 | # |
302 | # some conflicts with the outline exist |
303 | |
304 | # SOT23 generic package with counter-clockweise or clockwise pin assignment |
305 | F: sot23 |
306 | # |
307 | # - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern |
308 | # http://www.diodes.com/datasheets/APX803.pdf |
309 | # |
310 | # for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern |
311 | # http://www.fairchildsemi.com/dwg/MA/MA03D.pdf |
312 | # |
313 | |
314 | # Standard rectangular passive components |
315 | F: stdpass |
316 | # |
317 | # packages: 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2010, 2512 |
318 | # polarized(marked the cathode) packages: starts from 0603P to 2512P |
319 | # |
320 | # be noticed that 1812 land pattern based on a p/n: miniSMDC200F from Tycoelectronics |
321 | # http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Catalog+Section%7FSURFACE-MOUNT%7FA1%7Fpdf%7FEnglish%7FENG_CS_SURFACE-MOUNT_A1.pdf%7FRF1410-000 |
322 | # |
323 | |
324 | # SOT-323 package with counter-clockweise or clockwise pin assignment |
325 | F: sot-323 |
326 | N: mmst3904 |
327 | |
328 | # http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml] |
329 | # http://www.nxp.com/packages/SOT341-1.html |
330 | # http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf |
331 | |
332 | # "Generic" simple SSOP |
333 | F: ssop |
334 | # |
335 | # - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing |
336 | # http://www.micrel.com/_PDF/mic2550a.pdf |
337 | # |
338 | # - TSSOP14: from NXP -> package land pattern |
339 | # http://www.nxp.com/packages/SOT402-1.html |
340 | # http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf |
341 | |
342 | # SWITCH, TACTILE, SPST, R/A, THROUGH HOLE |
343 | F: tactile-sw-spst-ra-dip.fpd |
344 | # |
345 | # - TACTIL-SW-${TYPE}-RA-${A}-${B}, package drawing, land pattern |
346 | # for example TYCO ELECTRONICS FSMRA2JH |
347 | # http://www.farnell.com/datasheets/51343.pdf |
348 | # |
349 | |
350 | # "Generic" simple TO-252, TO-263 |
351 | F: to |
352 | # |
353 | # - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252 |
354 | # http://www.ti.com/lit/ds/symlink/lp38690.pdf |
355 | # |
356 | # - JEDEC Spec: TO-252 AA -> package drawing and land pattern |
357 | # http://www.national.com/packaging/mkt/td03b.pdf |
358 | # |
359 | # - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263 |
360 | # http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf |
361 | # |
362 | # - JEDEC Spec: TO-263 THIN -> package drawing and land pattern |
363 | # http://www.national.com/packaging/mkt/tj5a.pdf |
364 | # |
365 | |
366 | # "Generic" simple TSOP |
367 | F: tsop |
368 | # |
369 | # - TSOP28: Z28 -> package drawing |
370 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF |
371 | # |
372 | # - TSOP28: Z28 -> package land pattern |
373 | # http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF |
374 | # |
375 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
376 | # the TSOP32 referred to the same package drawing and land pattern |
377 | # |
378 | # - TSOP32: Z32 -> package drawing |
379 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF |
380 | # |
381 | # - TSOP32: Z32 -> package land pattern |
382 | # http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF |
383 | # |
384 | # - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56 |
385 | # http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx |
386 | # |
387 | # - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing |
388 | # http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf |
389 | # |
390 | # - TSOP66: currently referred to M1rc3 design files land pattern: |
391 | # width of pad -> 0.4 mm, it's rectangle not round one |
392 | # length of pad -> 1.25 mm |
393 | # Width of body -> 400 mil |
394 | |
395 | # TSSOP5 for NXP |
396 | F: tssop5 |
397 | # |
398 | # - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet, |
399 | # http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf |
400 | # http://www.nxp.com/packages/SOT353-1.html |
401 | # but without real land pattern found, still could refer link below for more in details: |
402 | # http://www.nxp.com/documents/application_note/AN10365.pdf |
403 | # |
404 | # also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353 |
405 | # they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it. |
406 | # |
407 | # NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm. |
408 | # could use a land pattern of pad length to be 0.7 mm. |
409 | # |
410 | |
411 | # USB DUAL STACKED A RECEPT CON R/A |
412 | # F: usb-a-dual-recept-r |
413 | # |
414 | # - USB-A-DUAL-RECEPT-RA, package drawing, land pattern |
415 | # for example MOLEX 67298-4090 |
416 | # http://www.molex.com/pdm_docs/sd/672984090_sd.pdf |
417 | # |
418 | |
419 | # USB A plug for SMT |
420 | # |
421 | # Note: the signal pads are enlarged by 0.2 mm and their center is shifted by |
422 | # 0.1 mm with respect to the reference. |
423 | # |
424 | # According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+ |
425 | # 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the |
426 | # edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the |
427 | # maximum lead end could be at 3.58 mm while the minimum pad edge could be at |
428 | # 3.5 mm. |
429 | # |
430 | # Assuming that the pad is intended to extend a bit beyond the lead, we need |
431 | # to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not |
432 | # be intended to be used this way, however, we still have to consider small |
433 | # errors in registration, which also amount to about 0.1 mm, so the calculation |
434 | # remains valid.) |
435 | # |
436 | F: usb_a_plug_smt |
437 | |
438 | # USB 2.0 from usb_20_040908, page 99 |
439 | F: usb-a-pcb |
440 | |
441 | # XLR, SOCKET, PANEL, HORIZ/PCB |
442 | F: xlr-socket |
443 | # |
444 | # - XLR-PANEL-HORIZ/PCB-SOCKET, package drawing, land pattern |
445 | # for example NEUTRIK NC3FAH1 |
446 | # http://www.neutrik.us/en-us/xlr/a-series/nc3fah1 |
447 | # |
448 | |
449 | # XLR, PLUG, PANEL, HORIZ/PCB |
450 | F: xlr-plug |
451 | # |
452 | # - XLR-PANEL-HORIZ/PCB-PLUG, package drawing, land pattern |
453 | # for example NEUTRIK NC3MAH |
454 | # http://www.neutrik.us/en-us/xlr/a-series/nc3mah |
455 | # |
456 | |
457 | # 2-pins rectangular smd xtal |
458 | F: xtal-2 |
459 | # |
460 | # - xtal2-11.5mmx4.83mm package drawing, land pattern |
461 | # for example R49SSA-028636-F20-YYY-YQA |
462 | # http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf |
463 | # |
464 | |
465 | # 4-pins rectangular smd xtal |
466 | F: xtal-4 |
467 | # |
468 | # - xtal4-3.2mmx2.5mm package drawing, land pattern |
469 | # for example NX3225SA |
470 | # http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf |
471 | # |
472 | # - xtal4-5mmx3.2mm package drawing, land pattern |
473 | # for example SO5032-050000-O3A-BBE-QA |
474 | # http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/FPGA/Qi%20Hardware%20SO5032-050000-O3A-BBE-QA.pdf |
475 | # |
476 | # - xtal4-6mmx3.6mm package drawing, land pattern |
477 | # for example ABMM2-24.576MHZ-E2-T |
478 | # http://www.abracon.com/Resonators/ABMM2.pdf |
479 | # |
480 | |
481 | |
482 |
Branches:
master