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Source at commit dfcaa9dba51be5ed4007b7081440ad77f4243d23 created 11 years 9 months ago. By Adam Wang, tsop.fpd: added new TSOP module | |
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1 | # |
2 | # Tags: |
3 | # |
4 | # F Footprint name (must be first) |
5 | # N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F) |
6 | # |
7 | |
8 | # Standard rectangular passive components |
9 | F: stdpass |
10 | |
11 | # Solder pads and test points |
12 | F: pads |
13 | |
14 | # Printed 8:10 card contacs |
15 | F: 8_10-card |
16 | |
17 | # Fiducial (1 mm copper pad, 2 mm solder mask clearance) |
18 | F: fiducial |
19 | |
20 | # "Generic" simple QFN |
21 | F: qfn |
22 | # |
23 | # The information for these packages comes from various sources: |
24 | # |
25 | # - the C8051F326 data sheet, for the QFN28 footprint (N: mcu) |
26 | # - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx) |
27 | # - Atmel's general recommendations for QFN land patterns (N: atmel-qfn) |
28 | # - NXP's SOT617-1 and SOT617-3, for package and land pattern: |
29 | # http://www.nxp.com/package/SOT617-1.html |
30 | # http://www.nxp.com/package/SOT617-3.html |
31 | # |
32 | # Solder paste: |
33 | # |
34 | # Footprint Center pad Closest NXP (with complete land pattern) |
35 | # QFN28-Atmel 2.4 mm for further study |
36 | # QFN28-SiLabs 3.3 mm use SiLab's specification |
37 | # QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1 |
38 | # QFN32-VHHD-6 3.4 mm SOT818-1 |
39 | # |
40 | # From NXP: |
41 | # |
42 | # Package Pad Paste zone Islands Isl. size Isl. gap |
43 | # SiLabs 3.25 3.1 3 x 3 0.9 |
44 | # SOT818-1 3.4 1.75 2 x 2 0.75 0.25 |
45 | # SOT788-1 4.0 2.4 3 x 3 0.6 0.3 |
46 | # |
47 | # NXP rules (AN10365): |
48 | # - paste zone = 35% of pad area |
49 | # - paste coverge = 20% of pad area |
50 | # |
51 | # Our parameters: |
52 | # |
53 | # Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage |
54 | # QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20% |
55 | # QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19% |
56 | # |
57 | # Known bugs: |
58 | # |
59 | # - really ought to merge all the various QFN definitions (we have more |
60 | # over at gta02-core) into a single QFN file with a big mean table of |
61 | # everything |
62 | # |
63 | N: sot617-3-lp |
64 | |
65 | # "Generic" simple QFP (for now, just for Silabs' C8051F320) |
66 | F: qfp |
67 | # |
68 | # - the C8051F320 data sheet |
69 | # http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf |
70 | # |
71 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
72 | # the LQPF48/TQFP48 referred to the same package drawing and land pattern |
73 | # |
74 | # - LQFP48, TQFP48: C48 -> package drawing |
75 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF |
76 | # |
77 | # - LQFP48, TQFP48: C48 -> package land pattern |
78 | # http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF |
79 | # |
80 | |
81 | # Mini-USB B receptable (SMT; almost generic) |
82 | F: mini_usb_b |
83 | |
84 | # USB A plug for SMT |
85 | # |
86 | # Note: the signal pads are enlarged by 0.2 mm and their center is shifted by |
87 | # 0.1 mm with respect to the reference. |
88 | # |
89 | # According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+ |
90 | # 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the |
91 | # edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the |
92 | # maximum lead end could be at 3.58 mm while the minimum pad edge could be at |
93 | # 3.5 mm. |
94 | # |
95 | # Assuming that the pad is intended to extend a bit beyond the lead, we need |
96 | # to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not |
97 | # be intended to be used this way, however, we still have to consider small |
98 | # errors in registration, which also amount to about 0.1 mm, so the calculation |
99 | # remains valid.) |
100 | # |
101 | F: usb_a_plug_smt |
102 | |
103 | # USB 2.0 from usb_20_040908, page 99 |
104 | F: usb-a-pcb |
105 | |
106 | # SOT-323 package with counter-clockweise or clockwise pin assignment |
107 | F: sot-323 |
108 | N: mmst3904 |
109 | |
110 | # http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml] |
111 | # http://www.nxp.com/packages/SOT341-1.html |
112 | # http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf |
113 | F: ssop |
114 | |
115 | # experimental generic SOT footprint; currently only for |
116 | # |
117 | # - SOT-323 aka SC-70 |
118 | # http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF |
119 | # - SOT-363 aka SC-88 aka SC-70-6 |
120 | # http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF |
121 | # - SOT-523 |
122 | # http://www.diodes.com/datasheets/ds31784.pdf |
123 | # - SOT-563 |
124 | # http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF |
125 | # |
126 | # some conflicts with the outline exist |
127 | |
128 | F: sot |
129 | |
130 | # MDIP |
131 | F: mdip |
132 | # |
133 | # From FAIRCHILD: |
134 | # |
135 | # - the 6N138S data sheet |
136 | # http://www.fairchildsemi.com/ds/6N/6N138.pdf |
137 | # |
138 | # Package Type: |
139 | # |
140 | # - MDIP 8L |
141 | # http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08 |
142 | # |
143 | # Package Drawing: |
144 | # |
145 | # http://www.fairchildsemi.com/dwg/N0/N08H.pdf |
146 | |
147 | # SOIC |
148 | F: soic |
149 | # |
150 | # From TI: |
151 | # |
152 | # - the SN75HVD12DR data sheet |
153 | # http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf |
154 | # |
155 | # Package Drawing: |
156 | # |
157 | # - D(JEDEC) |
158 | # - R-PDSO-G8 |
159 | # http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf |
160 | # - R-PDSO-G14 |
161 | # http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf |
162 | # - R-PDSO-G16 |
163 | # http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf |
164 | |
165 | # IR Receiver Module |
166 | F: ir |
167 | # |
168 | # From Vishay: |
169 | # |
170 | # - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet |
171 | # http://www.vishay.com/docs/81732/tsop348.pdf |
172 | |
173 | # "Generic" simple TSOP |
174 | F: tsop |
175 | # |
176 | # - the JS28F256J3F105 data sheet, it's TSOP-56 |
177 | # http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx |
178 | # |
179 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
180 | # the TSOP32 referred to the same package drawing and land pattern |
181 | # |
182 | # - TSOP32: Z32 -> package drawing |
183 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF |
184 | # |
185 | # - TSOP32: Z32 -> package land pattern |
186 | # http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF |
187 | # |
188 | |
189 | |
190 |
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