Root/modules/INFO

Source at commit e3556cabf2bd9bc5d265be63c6458e37f5d6f324 created 8 years 3 months ago.
By Adam Wang, INFO: clean up by order
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# Printed 8:10 card contacs
9F: 8_10-card
10
11# EUS (R-PDSS-T6)
12F: eus
13#
14# - for example: the PTH04000WAH data sheet, it's EUS
15# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
16#
17
18# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
19F: fiducial
20
21# IR Receiver Module
22F: ir
23#
24# From Vishay:
25#
26# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
27# http://www.vishay.com/docs/81732/tsop348.pdf
28
29# MDIP
30F: mdip
31#
32# From FAIRCHILD:
33#
34# - the 6N138S data sheet
35# http://www.fairchildsemi.com/ds/6N/6N138.pdf
36#
37# Package Type:
38#
39# - MDIP 8L
40# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
41#
42# Package Drawing:
43#
44# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
45
46# Mini-USB B receptable (SMT; almost generic)
47F: mini_usb_b
48
49# Solder pads and test points
50F: pads
51
52# "Generic" simple QFN
53F: qfn
54#
55# The information for these packages comes from various sources:
56#
57# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
58# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
59# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
60# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
61# http://www.nxp.com/package/SOT617-1.html
62# http://www.nxp.com/package/SOT617-3.html
63#
64# Solder paste:
65#
66# Footprint Center pad Closest NXP (with complete land pattern)
67# QFN28-Atmel 2.4 mm for further study
68# QFN28-SiLabs 3.3 mm use SiLab's specification
69# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
70# QFN32-VHHD-6 3.4 mm SOT818-1
71#
72# From NXP:
73#
74# Package Pad Paste zone Islands Isl. size Isl. gap
75# SiLabs 3.25 3.1 3 x 3 0.9
76# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
77# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
78#
79# NXP rules (AN10365):
80# - paste zone = 35% of pad area
81# - paste coverge = 20% of pad area
82#
83# Our parameters:
84#
85# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
86# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
87# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
88#
89# Known bugs:
90#
91# - really ought to merge all the various QFN definitions (we have more
92# over at gta02-core) into a single QFN file with a big mean table of
93# everything
94#
95N: sot617-3-lp
96
97# "Generic" simple QFP (for now, just for Silabs' C8051F320)
98F: qfp
99#
100# - the C8051F320 data sheet
101# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
102#
103# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
104# the LQPF48/TQFP48 referred to the same package drawing and land pattern
105#
106# - LQFP48, TQFP48: C48 -> package drawing
107# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
108#
109# - LQFP48, TQFP48: C48 -> package land pattern
110# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
111#
112
113# SOIC
114F: soic
115#
116# From TI:
117#
118# - the SN75HVD12DR data sheet
119# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
120#
121# Package Drawing:
122#
123# - D(JEDEC)
124# - R-PDSO-G8
125# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
126# - R-PDSO-G14
127# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
128# - R-PDSO-G16
129# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
130
131F: sot
132
133# Standard rectangular passive components
134F: stdpass
135
136# SOT-323 package with counter-clockweise or clockwise pin assignment
137F: sot-323
138N: mmst3904
139
140# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
141# http://www.nxp.com/packages/SOT341-1.html
142# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
143F: ssop
144
145# experimental generic SOT footprint; currently only for
146#
147# - SOT-323 aka SC-70
148# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
149# - SOT-363 aka SC-88 aka SC-70-6
150# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
151# - SOT-523
152# http://www.diodes.com/datasheets/ds31784.pdf
153# - SOT-563
154# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
155#
156# some conflicts with the outline exist
157
158# "Generic" simple TSOP
159F: tsop
160#
161# - the JS28F256J3F105 data sheet, it's TSOP-56
162# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
163#
164# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
165# the TSOP32 referred to the same package drawing and land pattern
166#
167# - TSOP28: Z28 -> package drawing
168# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
169#
170# - TSOP28: Z28 -> package land pattern
171# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
172#
173#
174# - TSOP32: Z32 -> package drawing
175# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
176#
177# - TSOP32: Z32 -> package land pattern
178# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
179#
180
181# "Generic" simple TO-252
182F: to-252
183#
184# - for example: the LP38690DT-3.3 data sheet, it's TO-252
185# http://www.ti.com/lit/ds/symlink/lp38690.pdf
186#
187# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
188# http://www.national.com/packaging/mkt/td03b.pdf
189#
190
191# USB A plug for SMT
192#
193# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
194# 0.1 mm with respect to the reference.
195#
196# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
197# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
198# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
199# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
200# 3.5 mm.
201#
202# Assuming that the pad is intended to extend a bit beyond the lead, we need
203# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
204# be intended to be used this way, however, we still have to consider small
205# errors in registration, which also amount to about 0.1 mm, so the calculation
206# remains valid.)
207#
208F: usb_a_plug_smt
209
210# USB 2.0 from usb_20_040908, page 99
211F: usb-a-pcb
212
213
214

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