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Source at commit e3556cabf2bd9bc5d265be63c6458e37f5d6f324 created 11 years 9 months ago. By Adam Wang, INFO: clean up by order | |
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1 | # |
2 | # Tags: |
3 | # |
4 | # F Footprint name (must be first) |
5 | # N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F) |
6 | # |
7 | |
8 | # Printed 8:10 card contacs |
9 | F: 8_10-card |
10 | |
11 | # EUS (R-PDSS-T6) |
12 | F: eus |
13 | # |
14 | # - for example: the PTH04000WAH data sheet, it's EUS |
15 | # http://www.ti.com/lit/ds/symlink/pth04000w.pdf |
16 | # |
17 | |
18 | # Fiducial (1 mm copper pad, 2 mm solder mask clearance) |
19 | F: fiducial |
20 | |
21 | # IR Receiver Module |
22 | F: ir |
23 | # |
24 | # From Vishay: |
25 | # |
26 | # - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet |
27 | # http://www.vishay.com/docs/81732/tsop348.pdf |
28 | |
29 | # MDIP |
30 | F: mdip |
31 | # |
32 | # From FAIRCHILD: |
33 | # |
34 | # - the 6N138S data sheet |
35 | # http://www.fairchildsemi.com/ds/6N/6N138.pdf |
36 | # |
37 | # Package Type: |
38 | # |
39 | # - MDIP 8L |
40 | # http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08 |
41 | # |
42 | # Package Drawing: |
43 | # |
44 | # http://www.fairchildsemi.com/dwg/N0/N08H.pdf |
45 | |
46 | # Mini-USB B receptable (SMT; almost generic) |
47 | F: mini_usb_b |
48 | |
49 | # Solder pads and test points |
50 | F: pads |
51 | |
52 | # "Generic" simple QFN |
53 | F: qfn |
54 | # |
55 | # The information for these packages comes from various sources: |
56 | # |
57 | # - the C8051F326 data sheet, for the QFN28 footprint (N: mcu) |
58 | # - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx) |
59 | # - Atmel's general recommendations for QFN land patterns (N: atmel-qfn) |
60 | # - NXP's SOT617-1 and SOT617-3, for package and land pattern: |
61 | # http://www.nxp.com/package/SOT617-1.html |
62 | # http://www.nxp.com/package/SOT617-3.html |
63 | # |
64 | # Solder paste: |
65 | # |
66 | # Footprint Center pad Closest NXP (with complete land pattern) |
67 | # QFN28-Atmel 2.4 mm for further study |
68 | # QFN28-SiLabs 3.3 mm use SiLab's specification |
69 | # QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1 |
70 | # QFN32-VHHD-6 3.4 mm SOT818-1 |
71 | # |
72 | # From NXP: |
73 | # |
74 | # Package Pad Paste zone Islands Isl. size Isl. gap |
75 | # SiLabs 3.25 3.1 3 x 3 0.9 |
76 | # SOT818-1 3.4 1.75 2 x 2 0.75 0.25 |
77 | # SOT788-1 4.0 2.4 3 x 3 0.6 0.3 |
78 | # |
79 | # NXP rules (AN10365): |
80 | # - paste zone = 35% of pad area |
81 | # - paste coverge = 20% of pad area |
82 | # |
83 | # Our parameters: |
84 | # |
85 | # Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage |
86 | # QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20% |
87 | # QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19% |
88 | # |
89 | # Known bugs: |
90 | # |
91 | # - really ought to merge all the various QFN definitions (we have more |
92 | # over at gta02-core) into a single QFN file with a big mean table of |
93 | # everything |
94 | # |
95 | N: sot617-3-lp |
96 | |
97 | # "Generic" simple QFP (for now, just for Silabs' C8051F320) |
98 | F: qfp |
99 | # |
100 | # - the C8051F320 data sheet |
101 | # http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf |
102 | # |
103 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
104 | # the LQPF48/TQFP48 referred to the same package drawing and land pattern |
105 | # |
106 | # - LQFP48, TQFP48: C48 -> package drawing |
107 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF |
108 | # |
109 | # - LQFP48, TQFP48: C48 -> package land pattern |
110 | # http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF |
111 | # |
112 | |
113 | # SOIC |
114 | F: soic |
115 | # |
116 | # From TI: |
117 | # |
118 | # - the SN75HVD12DR data sheet |
119 | # http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf |
120 | # |
121 | # Package Drawing: |
122 | # |
123 | # - D(JEDEC) |
124 | # - R-PDSO-G8 |
125 | # http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf |
126 | # - R-PDSO-G14 |
127 | # http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf |
128 | # - R-PDSO-G16 |
129 | # http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf |
130 | |
131 | F: sot |
132 | |
133 | # Standard rectangular passive components |
134 | F: stdpass |
135 | |
136 | # SOT-323 package with counter-clockweise or clockwise pin assignment |
137 | F: sot-323 |
138 | N: mmst3904 |
139 | |
140 | # http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml] |
141 | # http://www.nxp.com/packages/SOT341-1.html |
142 | # http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf |
143 | F: ssop |
144 | |
145 | # experimental generic SOT footprint; currently only for |
146 | # |
147 | # - SOT-323 aka SC-70 |
148 | # http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF |
149 | # - SOT-363 aka SC-88 aka SC-70-6 |
150 | # http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF |
151 | # - SOT-523 |
152 | # http://www.diodes.com/datasheets/ds31784.pdf |
153 | # - SOT-563 |
154 | # http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF |
155 | # |
156 | # some conflicts with the outline exist |
157 | |
158 | # "Generic" simple TSOP |
159 | F: tsop |
160 | # |
161 | # - the JS28F256J3F105 data sheet, it's TSOP-56 |
162 | # http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx |
163 | # |
164 | # according to MAXIM web: http://www.maxim-ic.com/design/packaging/ |
165 | # the TSOP32 referred to the same package drawing and land pattern |
166 | # |
167 | # - TSOP28: Z28 -> package drawing |
168 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF |
169 | # |
170 | # - TSOP28: Z28 -> package land pattern |
171 | # http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF |
172 | # |
173 | # |
174 | # - TSOP32: Z32 -> package drawing |
175 | # http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF |
176 | # |
177 | # - TSOP32: Z32 -> package land pattern |
178 | # http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF |
179 | # |
180 | |
181 | # "Generic" simple TO-252 |
182 | F: to-252 |
183 | # |
184 | # - for example: the LP38690DT-3.3 data sheet, it's TO-252 |
185 | # http://www.ti.com/lit/ds/symlink/lp38690.pdf |
186 | # |
187 | # - JEDEC Spec: TO-252 AA -> package drawing and land pattern |
188 | # http://www.national.com/packaging/mkt/td03b.pdf |
189 | # |
190 | |
191 | # USB A plug for SMT |
192 | # |
193 | # Note: the signal pads are enlarged by 0.2 mm and their center is shifted by |
194 | # 0.1 mm with respect to the reference. |
195 | # |
196 | # According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+ |
197 | # 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the |
198 | # edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the |
199 | # maximum lead end could be at 3.58 mm while the minimum pad edge could be at |
200 | # 3.5 mm. |
201 | # |
202 | # Assuming that the pad is intended to extend a bit beyond the lead, we need |
203 | # to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not |
204 | # be intended to be used this way, however, we still have to consider small |
205 | # errors in registration, which also amount to about 0.1 mm, so the calculation |
206 | # remains valid.) |
207 | # |
208 | F: usb_a_plug_smt |
209 | |
210 | # USB 2.0 from usb_20_040908, page 99 |
211 | F: usb-a-pcb |
212 | |
213 | |
214 |
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