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Source at commit eb8132ce8e6b43a2f04ab5c151cfcebf7929a93b created 7 years 6 months ago.
By Adam Wang, xtal-2.fpd: added 2-pins smd xtal pattern -> xtal2-11.5mmx4.83mm
1#
2# Tags:
3#
4# F Footprint name (must be first)
5# N Data sheet identifier (N tag of BOOKSHELF; can be omitted if equal to F)
6#
7
8# Printed 8:10 card contacs
9F: 8_10-card
10
11# Open clip for AA batteries, through-hole
12# http://www.memoryprotectiondevices.com/datasheets/BK-92-datasheet.pdf
13# Note: should generalize this for AAA and maybe also larger sizes
14F: bat-clip-aa-th
15
16# BGA
17F: bga
18# - 484-Pin FineLine BGA(FBGA), from Altera
19# http://www.altera.com/devicepackaging/04R00416-02.pdf
20#
21# - FG(G)484 Fine-Pitch BGA, from Xilinx
22# http://www.xilinx.com/support/documentation/user_guides/ug385.pdf
23#
24
25# DO-214
26F: do-214
27#
28# - DO-214AA(SMB), from Fairchild, for example its 2N7002MTF uses it
29# http://www.fairchildsemi.com/dwg/DO/DO214AA.pdf
30#
31# - DO-214AB(SMC), from Fairchild
32# http://www.fairchildsemi.com/dwg/DO/DO214AB.pdf
33#
34# - DO-214AC(SMA), from Fairchild
35# http://www.fairchildsemi.com/dwg/DO/DO214AC.pdf
36#
37
38# EUS (R-PDSS-T6)
39F: eus
40#
41# - for example: the PTH04000WAH data sheet, it's EUS
42# http://www.ti.com/lit/ds/symlink/pth04000w.pdf
43#
44
45# Fiducial (1 mm copper pad, 2 mm solder mask clearance)
46F: fiducial
47
48# IR Receiver Module
49F: ir
50#
51# From Vishay:
52#
53# - the TSOP322.., TSOP324.., TSOP348.., TSOP344.. data sheet
54# http://www.vishay.com/docs/81732/tsop348.pdf
55
56# LED right angle package
57F: ledsmd
58#
59# - LEDSMD-0603R: for example: the APA1606SURCK data sheet, package drawing
60# http://www.us.kingbright.com/images/catalog/SPEC/APA1606SURCK.pdf
61# added a letter 'R' stands for right angle land pattern
62# could expand it as else land pattern for 0603, 0805, 0805R, etc.
63#
64
65# MDIP
66F: mdip
67#
68# From FAIRCHILD:
69#
70# - the 6N138S data sheet
71# http://www.fairchildsemi.com/ds/6N/6N138.pdf
72#
73# Package Type:
74#
75# - MDIP 8L
76# http://www.fairchildsemi.com/package/packageDetails.html?id=PN_192-B08
77#
78# Package Drawing:
79#
80# http://www.fairchildsemi.com/dwg/N0/N08H.pdf
81
82# Mini-USB B receptable (SMT; almost generic)
83F: mini_usb_b
84
85# Solder pads and test points
86F: pads
87
88# "Generic" simple QFN
89F: qfn
90#
91# The information for these packages comes from various sources:
92#
93# - the C8051F326 data sheet, for the QFN28 footprint (N: mcu)
94# - the AT86F326 data sheet, for the QFN32 package dimensions (N: txrx)
95# - Atmel's general recommendations for QFN land patterns (N: atmel-qfn)
96# - NXP's SOT617-1 and SOT617-3, for package and land pattern:
97# http://www.nxp.com/package/SOT617-1.html
98# http://www.nxp.com/package/SOT617-3.html
99#
100# Solder paste:
101#
102# Footprint Center pad Closest NXP (with complete land pattern)
103# QFN28-Atmel 2.4 mm for further study
104# QFN28-SiLabs 3.3 mm use SiLab's specification
105# QFN32-VHHD-2 3.7 mm between SOT818-1 and SOT788-1
106# QFN32-VHHD-6 3.4 mm SOT818-1
107#
108# From NXP:
109#
110# Package Pad Paste zone Islands Isl. size Isl. gap
111# SiLabs 3.25 3.1 3 x 3 0.9
112# SOT818-1 3.4 1.75 2 x 2 0.75 0.25
113# SOT788-1 4.0 2.4 3 x 3 0.6 0.3
114#
115# NXP rules (AN10365):
116# - paste zone = 35% of pad area
117# - paste coverge = 20% of pad area
118#
119# Our parameters:
120#
121# Package Pad Paste zone Islands Isl. size Isl. gap Zone Coverage
122# QFN32-VHHD-2 3.7 2.15 3 x 3 0.55 0.25 34% 20%
123# QFN32-VHHD-6 3.4 1.95 2 x 2 0.75 0.45 33% 19%
124#
125# Known bugs:
126#
127# - really ought to merge all the various QFN definitions (we have more
128# over at gta02-core) into a single QFN file with a big mean table of
129# everything
130#
131N: sot617-3-lp
132
133# "Generic" simple QFP (for now, just for Silabs' C8051F320)
134F: qfp
135#
136# - the C8051F320 data sheet
137# http://www.silabs.com/Support%20Documents/TechnicalDocs/C8051F32x.pdf
138#
139# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
140# the LQPF48/TQFP48 referred to the same package drawing and land pattern
141#
142# - LQFP48, TQFP48: C48 -> package drawing
143# http://pdfserv.maxim-ic.com/package_dwgs/21-0054.PDF
144#
145# - LQFP48, TQFP48: C48 -> package land pattern
146# http://pdfserv.maxim-ic.com/land_patterns/90-0093.PDF
147#
148# - LQFP64, JEDEC MS-026-BCD for example: the ADV7181CBSTZ data sheet, package drawing
149# http://www.analog.com/static/imported-files/data_sheets/ADV7181C.pdf
150#
151# - LQFP64, C64 -> package drawing
152# http://pdfserv.maxim-ic.com/package_dwgs/21-0083.PDF
153#
154# - LQFP64, C64 -> package land pattern
155# http://pdfserv.maxim-ic.com/land_patterns/90-0141.PDF
156#
157
158# SOIC
159F: soic
160#
161# From TI:
162#
163# - the SN75HVD12DR data sheet
164# http://www.ti.com/lit/ds/symlink/sn75hvd12.pdf
165#
166# Package Drawing:
167#
168# - D(JEDEC)
169# - R-PDSO-G8
170# http://www-s.ti.com/sc/psheets/msoi002j/msoi002j.pdf
171# - R-PDSO-G14
172# http://www-s.ti.com/sc/psheets/mpds177g/mpds177g.pdf
173# - R-PDSO-G16
174# http://www-s.ti.com/sc/psheets/mpds178g/mpds178g.pdf
175
176# SOT generic package
177F: sot
178# experimental generic SOT footprint; currently only for
179#
180# - SOT-323 aka SC-70
181# http://www.onsemi.com/pub_link/Collateral/BAV99WT1-D.PDF
182# - SOT-363 aka SC-88 aka SC-70-6
183# http://www.onsemi.com/pub_link/Collateral/MBT3946DW1T1-D.PDF
184# - SOT-523
185# http://www.diodes.com/datasheets/ds31784.pdf
186# - SOT-563
187# http://www.onsemi.com/pub_link/Collateral/NTZD3155C-D.PDF
188#
189# some conflicts with the outline exist
190
191# SOT23 generic package with counter-clockweise or clockwise pin assignment
192F: sot23
193#
194# - SOT23: aka JEDEC TO-236 for example, the APX803-40SAG-7 data sheet, package drawing and land pattern
195# http://www.diodes.com/datasheets/APX803.pdf
196#
197# for another example from Fairchildsemi 2N7002MTF, package drawing and land pattern
198# http://www.fairchildsemi.com/dwg/MA/MA03D.pdf
199#
200
201# Standard rectangular passive components
202F: stdpass
203#
204# packages: 0201, 0402, 0603, 0805, 1206, 1210, 2010, 2512
205# polarized(marked the cathode) packages: starts from 0603P to 2512P
206#
207
208# SOT-323 package with counter-clockweise or clockwise pin assignment
209F: sot-323
210N: mmst3904
211
212# http://www.nxp.com/#/page/content=[f=/packages/SOT341-1.xml]
213# http://www.nxp.com/packages/SOT341-1.html
214# http://www.nxp.com/documents/reflow_soldering/SSOP-TSSOP-VSO-REFLOW.pdf
215
216# "Generic" simple SSOP
217F: ssop
218#
219# - TSSOP14: for example: the MIC2550AYTS data sheet, package drawing
220# http://www.micrel.com/_PDF/mic2550a.pdf
221#
222# - TSSOP14: from NXP -> package land pattern
223# http://www.nxp.com/packages/SOT402-1.html
224# http://www.nxp.com/documents/reflow_soldering/sot402-1_fr.pdf
225
226# "Generic" simple TO-252, TO-263
227F: to
228#
229# - TO-252 for example: the LP38690DT-3.3 data sheet, it's TO-252
230# http://www.ti.com/lit/ds/symlink/lp38690.pdf
231#
232# - JEDEC Spec: TO-252 AA -> package drawing and land pattern
233# http://www.national.com/packaging/mkt/td03b.pdf
234#
235# - TO-263 for example: the LP38511TJ-ADJ/NOPB data sheet, it's TO-263
236# http://www.ti.com/lit/ds/symlink/lp38511-adj.pdf
237#
238# - JEDEC Spec: TO-263 THIN -> package drawing and land pattern
239# http://www.national.com/packaging/mkt/tj5a.pdf
240#
241
242# "Generic" simple TSOP
243F: tsop
244#
245# - TSOP28: Z28 -> package drawing
246# http://pdfserv.maxim-ic.com/package_dwgs/21-0273.PDF
247#
248# - TSOP28: Z28 -> package land pattern
249# http://pdfserv.maxim-ic.com/land_patterns/90-0319.PDF
250#
251# according to MAXIM web: http://www.maxim-ic.com/design/packaging/
252# the TSOP32 referred to the same package drawing and land pattern
253#
254# - TSOP32: Z32 -> package drawing
255# http://pdfserv.maxim-ic.com/package_dwgs/21-0274.PDF
256#
257# - TSOP32: Z32 -> package land pattern
258# http://pdfserv.maxim-ic.com/land_patterns/90-0320.PDF
259#
260# - TSOP56: the JS28F256J3F105 data sheet, it's TSOP-56
261# http://www.micron.com/parts/nor-flash/parallel-nor-flash/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/6062319942_J3_65_256M_MLC_DS.ashx
262#
263# - TSOP66: for example: the MT46V32M16P-5B:F data sheet, it's 400 mil, package drawing
264# http://download.micron.com/pdf/datasheets/dram/ddr/512MBDDRx4x8x16.pdf
265#
266# - TSOP66: currently referred to M1rc3 design files land pattern:
267# width of pad -> 0.4 mm, it's rectangle not round one
268# length of pad -> 1.25 mm
269# Width of body -> 400 mil
270
271# TSSOP5 for NXP
272F: tssop5
273#
274# - TSSOP5 aka for example package drawing SOT353-1 from NXP 74AUP1G08GW data sheet,
275# http://www.nxp.com/documents/data_sheet/74AUP1G08.pdf
276# http://www.nxp.com/packages/SOT353-1.html
277# but without real land pattern found, still could refer link below for more in details:
278# http://www.nxp.com/documents/application_note/AN10365.pdf
279#
280# also check OnSemi's MC74VHC1G135-D http://www.onsemi.cn/pub_link/Collateral/MC74VHC1G135-D.PDF for SOT-353
281# they both TSSOP5(NXP) and SOT-353(OnSemi) are quite similar. OnSemi has land pattern for it.
282#
283# NXP's Lp is 0.46 mm in max., OnSemi's K is 0.3 mm max. with a land pattern of pad length 0.5 mm.
284# could use a land pattern of pad length to be 0.7 mm.
285#
286
287# USB A plug for SMT
288#
289# Note: the signal pads are enlarged by 0.2 mm and their center is shifted by
290# 0.1 mm with respect to the reference.
291#
292# According to the data sheet, the leads terminate at (2.00+/-0.10 mm)/2+
293# 2.48 mm = 3.48+/-0.10 mm from the center. The reference footprint puts the
294# edge of the pads at (2.00+/-0.10 mm)/2+2.6 mm = 3.6 mm+/-0.10 mm, so the
295# maximum lead end could be at 3.58 mm while the minimum pad edge could be at
296# 3.5 mm.
297#
298# Assuming that the pad is intended to extend a bit beyond the lead, we need
299# to add 0.2 mm to compensate for these tolerances. (The pad tolerance may not
300# be intended to be used this way, however, we still have to consider small
301# errors in registration, which also amount to about 0.1 mm, so the calculation
302# remains valid.)
303#
304F: usb_a_plug_smt
305
306# USB 2.0 from usb_20_040908, page 99
307F: usb-a-pcb
308
309# 2-pins rectangular smd xtal
310F: xtal-2
311#
312# - xtal2-11.5mmx4.83mm package drawing, land pattern
313# for example R49SSA-028636-F20-YYY-YQA
314# http://downloads.qi-hardware.com/hardware/milkymist_one/datasheet/VideoIn/Qi%20R49SSA-028636-F20-YYY-YQA.pdf
315#
316
317# 4-pins rectangular smd xtal
318F: xtal-4
319#
320# - xtal4-3.2mmx2.5mm package drawing, land pattern
321# for example NX3225SA
322# http://www.ndk.com/images/products/catalog/c_NX3225SA-STD-CSQ-1_e.pdf
323#
324# - xtal4-6mmx3.6mm package drawing, land pattern
325# for example ABMM2-24.576MHZ-E2-T
326# http://www.abracon.com/Resonators/ABMM2.pdf
327#
328
329

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